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Same model may have multiple batches, images only for reference.
191-PGM18018-10
Same model may have multiple batches, images only for reference.

191-PGM18018-10

Part No 191-PGM18018-10
Manufacturer Aries Electronics
Catalog Sockets for ICs, Transistors
Description CONN SOCKET PGA GOLD  /  Pos PGA Socket Gold Through Hole
Datasheet
191-PGM18018-10 Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects>Sockets for ICs, Transistors
Mfr Aries Electronics
Series PGM
Package Bulk
Type PGA
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 200.0µin (5.08µm)
Contact Material - Post Brass
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Temperature Range - Operating -55°C ~ 105°C
Termination Post Length 0.165" (4.19mm)
Material Flammability Rating UL94 V-0
Current Rating (Amps) 3 A
Base Product Number 191-PGM
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Standard Package 1
Win Source Part Number 1184947-191-PGM18018-10
Ultra Librarian 3D Model Ultra Librarian 191-PGM18018-10 CAD Model

Description

The PGM series PGA type socket from Aries Electronics is a high-quality connector designed for ICs and transistors.

  • Termination: Solder
  • Housing Material: Polyamide (PA46), nylon 4/6, glass-filled material with a UL94 V-0 flammability rating
  • Pitch: 0.100" (2.54mm)
  • Post Pitch: 0.100" (2.54mm)
  • Contact Finish (Mating): Gold with a thickness of 10.0µin (0.25µm)
  • Contact Finish (Post): Tin with a thickness of 200.0µin (5.08µm)
  • Contact Material (Mating): Beryllium Copper
  • Contact Material (Post): Brass
  • Mounting Type: Through-Hole
  • Temperature Range: -55°C to 105°C
  • Current Rating: 3A
  • REACH: Unaffected
  • MSL Level: 1 (Unlimited)

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