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MRF6S21140HS

Part No MRF6S21140HS
Manufacturer Freescale Semiconductor - NXP
Catalog OEM Parts (M - N)
Description MRF6S21140HS Freescale
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Win Source Part Number 1032398-MRF6S21140HS
Categories OEM Parts(M-N)
Manufacturer Freescale Semiconductor - NXP
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian MRF6S21140HS CAD Model

Description

The MRF6S21140HS is an RF power LDMOS transistor manufactured by NXP Semiconductors (formerly Freescale). It's designed for high-performance applications in the 2110-2170 MHz frequency range, typically used in cellular base stations and other communication systems.

Applications:

  • Cellular base stations: Power amplifiers for UMTS and LTE systems.
  • Public Mobile Radio (PMR): High-power amplifiers.
  • Industrial, Scientific, and Medical (ISM) applications: Power amplifiers for RF heating and medical equipment.
  • Broadcast Transmitters: VHF and UHF Transmitters.
  • Military Communications: High-power RF amplification.

Features:

  • LDMOS technology: Provides high gain, high efficiency, and excellent linearity.
  • High power output: Delivers 140W of output power.
  • High gain: Typically achieves 18 dB of gain.
  • High efficiency: Achieves up to 55% efficiency.
  • Integrated ESD protection: Protects the device from electrostatic discharge.
  • Thermally enhanced package: Designed for efficient heat dissipation.

Benefits:

  • Increased signal strength: Enables longer transmission distances and improved coverage.
  • Reduced power consumption: Lowers operating costs and extends battery life in portable devices.
  • Improved signal quality: Minimizes distortion and interference.
  • Enhanced reliability: Withstands high temperatures and harsh environmental conditions.
  • Simplified design: Reduces the number of external components required.

Additional Details:

The MRF6S21140HS is designed to operate with a supply voltage of 28V. The device is matched internally to optimize performance within the specified frequency range. The thermally enhanced package allows for efficient heat dissipation, enabling the device to operate at high power levels without overheating. It's critical to provide adequate heatsinking to ensure long-term reliability. This device is a key component in high-power RF amplification systems.

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