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600319\512MB\64MX8\8C

Part No 600319\512MB\64MX8\8C
Manufacturer Hynix Semiconductor
Catalog Memory - Modules
Description DDR2-800 64Mx64
Sample
Rohs State rohs
ECAD Module
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Categories Memory - Modules
Win Source Part Number 950400-600319\512MB\64MX8\8C
Series *
Ultra Librarian 3D Model Ultra Librarian 600319\512MB\64MX8\8C CAD Model

Description

The Hynix Semiconductor 600319 is a 512MB memory module configured as 64Mx8 with an 8C timing specification. This memory module is typically used to provide temporary data storage for a range of computing applications, ensuring that data is readily accessible to the processor for efficient operations.

Applications:

  • Embedded Systems: Integrated into various embedded devices requiring memory for data storage and processing.
  • Network Devices: Employed in routers, switches, and other networking equipment as buffer memory.
  • Industrial Control Systems: Used in industrial automation and control applications for storing process data.
  • Printers and Scanners: Provides memory for image processing and document handling.
  • Legacy Computing Systems: May be used in older desktop or laptop computers that support this memory configuration.

Features:

  • 512MB Capacity: Offers 512 megabytes of storage space for temporary data.
  • 64Mx8 Configuration: Organizes the memory into 64 million words, each 8 bits wide.
  • 8C Timing: Indicates a specific CAS Latency (Column Address Strobe latency) rating.
  • Standard Module Format: Adheres to a standard module form factor for compatibility.
  • Fast Data Transfer: Supports relatively fast data access and transfer rates.

Benefits:

  • Improved System Performance: Boosts the speed and responsiveness of the system by providing fast data access.
  • Enhanced Multitasking: Enables the simultaneous execution of multiple applications.
  • Increased Data Throughput: Facilitates quicker data processing and transfer rates.
  • Cost-Effective Memory Solution: Offers a balance of performance and affordability.
  • Easy Integration: Designed for straightforward installation into compatible systems.

Additional Details:

This Hynix memory module likely utilizes SDRAM (Synchronous Dynamic Random-Access Memory) or DDR SDRAM (Double Data Rate SDRAM) technology, although older technologies may also be present. The 64Mx8 configuration specifies the memory's organization, indicating that it's arranged into 64 million memory locations, each capable of storing 8 bits of data. The 8C timing refers to the CAS Latency (CL), an important timing parameter which defines the delay between the time a memory controller requests data and the time the memory module provides it. A lower CAS Latency generally results in faster memory performance. It is crucial to consult the datasheet for specific voltage, frequency, and timing requirements to ensure proper operation and compatibility. Proper handling, following antistatic precautions, is essential to prevent damage during installation.

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