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H5TC4G63GFR-RDC

Part No H5TC4G63GFR-RDC
Manufacturer Hynix Semiconductor
Catalog DDR
Description Incorrect partno DDR3-1866 256Mx16 (4Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 940643-H5TC4G63GFR-RDC
Series *
Ultra Librarian 3D Model Ultra Librarian H5TC4G63GFR-RDC CAD Model

Description

The Hynix H5TC4G63GFR-RDC is a DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) component designed for a variety of high-performance applications. This memory chip is frequently utilized in devices requiring substantial memory capacity and high-speed data access, making it suitable for both consumer and industrial applications.

Applications:

  • Desktop and laptop computers
  • Gaming consoles for fast data access
  • Networking equipment such as routers and switches
  • Embedded systems in industrial automation
  • Digital video recorders (DVRs)

Features:

  • DDR3 SDRAM Technology: Offers improved performance and lower power consumption compared to DDR2 SDRAM.
  • High Bandwidth: Enables rapid data transfer for demanding applications.
  • Low Voltage Operation: Reduces power consumption and heat generation, enhancing energy efficiency.
  • 8-bit prefetch architecture: Improves memory access efficiency.
  • On-Die Termination (ODT): Helps maintain signal integrity at high speeds.

Benefits:

  • Increased System Performance: Enhances overall system speed and responsiveness.
  • Reduced Power Consumption: Contributes to longer battery life in portable devices and lower energy costs.
  • Enhanced Reliability: Designed for stable and consistent performance under various operating conditions.
  • Greater Memory Capacity: Provides ample memory space for demanding applications.
  • Improved Gaming Experience: Facilitates smoother and more responsive gameplay.

Additional Details:

The H5TC4G63GFR-RDC's performance is primarily determined by its clock frequency, timing parameters, and operating voltage. It is essential for system designers and hardware engineers to consult the official datasheet to obtain precise technical specifications, including timing diagrams, voltage levels, and operating temperature ranges. Proper implementation and adherence to these specifications are crucial for maximizing the memory chip's potential and ensuring its reliable operation within the target system. In addition, understanding the thermal characteristics of the device is important for effective heat management and preventing overheating, which can impact performance and longevity.

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