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H9TQ26ABJTMCUR-KUM

Part No H9TQ26ABJTMCUR-KUM
Manufacturer Hynix Semiconductor
Catalog DDR
Description eMCP 32GB eMMC5.1 + 16Gb LPDDR3-1866
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 956675-H9TQ26ABJTMCUR-KUM
Series *
Ultra Librarian 3D Model Ultra Librarian H9TQ26ABJTMCUR-KUM CAD Model

Description

The H9TQ26ABJTMCUR-KUM is a high-performance mobile LPDDR4 SDRAM memory chip manufactured by Hynix Semiconductor. This memory component is designed to meet the demanding requirements of modern mobile devices, offering a balance of high bandwidth, low power consumption, and compact size.

Applications:

  • Smartphones: Used as main memory for applications and operating systems.
  • Tablets: Provides high-speed memory for running applications and handling data.
  • Mobile Computing Devices: Suitable for use in ultra-portable laptops and other mobile devices.
  • Wearable Devices: Ideal for smartwatches and other wearables that require low power and small form factor.

Features:

  • LPDDR4 SDRAM: Utilizes the low-power double data rate 4 (LPDDR4) standard for high-speed data transfer.
  • High Bandwidth: Offers a wide data bus for increased memory bandwidth.
  • Low Power Consumption: Designed for efficient power usage, extending battery life in mobile devices.
  • Compact Package: Comes in a small package to save space on the PCB.
  • Multi-Channel Architecture: Supports multi-channel memory access for improved performance.

Benefits:

  • Enhanced Performance: Enables faster application loading, smoother multitasking, and improved overall system performance.
  • Extended Battery Life: Low power consumption contributes to longer battery life in mobile devices.
  • Increased System Responsiveness: Reduces latency and improves the responsiveness of applications and the operating system.
  • Greater Memory Capacity: Provides ample memory capacity for demanding applications and large datasets.
  • Optimized Mobile Experience: Delivers a seamless and responsive user experience on mobile devices.

Additional Details:

This memory chip features advanced power management techniques to minimize power consumption in various operating modes. It supports various power-saving modes, such as deep sleep and power-down modes, to further optimize energy efficiency. The H9TQ26ABJTMCUR-KUM is also designed for reliable operation in harsh environments, with robust error detection and correction capabilities.

The specific density, operating voltage, and temperature range for the H9TQ26ABJTMCUR-KUM will depend on the exact configuration and manufacturing batch. Please refer to the official Hynix datasheet for comprehensive specifications and operational guidelines.

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Shipping Information

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