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HMT41GS6AFR8C-PBN0

Part No HMT41GS6AFR8C-PBN0
Manufacturer Hynix Semiconductor
Catalog Memory - Modules
Description DDR3-1600 1Gx64 SODIMM 2Rx8 (8GB)
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ECAD Module
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Categories Memory - Modules
Win Source Part Number 947547-HMT41GS6AFR8C-PBN0
Series *
Ultra Librarian 3D Model Ultra Librarian HMT41GS6AFR8C-PBN0 CAD Model

Description

The Hynix HMT41GS6AFR8C-PBN0 is a 8GB DDR3 1600MHz ECC Unbuffered DIMM (UDIMM) memory module, designed for workstations and entry-level servers. It provides reliable performance and data integrity through error correction. This module is designed for systems that require stable and accurate memory operations.

Applications

  • Workstations
  • Entry-level servers
  • Small business servers
  • Industrial PCs
  • Embedded systems requiring ECC memory

Features

  • DDR3 technology for high-speed data transfer
  • 8GB capacity
  • 1600MHz clock speed
  • ECC (Error-Correcting Code) for detecting and correcting single-bit memory errors
  • Unbuffered DIMM (UDIMM) design
  • 240-pin DIMM form factor
  • 1.5V operating voltage

Benefits

  • Increased system stability and data integrity due to ECC functionality
  • Improved performance for memory-intensive applications
  • Reliable operation in demanding environments
  • Compatibility with a wide range of motherboards and systems
  • Reduced downtime and data corruption

Additional Details

The HMT41GS6AFR8C-PBN0 module is compliant with JEDEC standards for DDR3 memory. The module is designed for easy installation and configuration. It provides a cost-effective solution for adding ECC memory to compatible systems. The ECC functionality helps prevent data corruption caused by random memory errors, ensuring reliable operation. This memory module is suitable for applications such as data logging, industrial control, and scientific computing, where data integrity is critical. The module uses a standard 240-pin DIMM connector, ensuring compatibility with a wide range of motherboards. It operates at a standard 1.5V voltage, reducing power consumption and heat generation. The part typically uses chips organized as 512M x 8. Consult the motherboard documentation for proper installation procedures and memory compatibility information. The module is rigorously tested to ensure compatibility and stability.

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Shipping Information

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