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EP2S130F1020I3N

Part No EP2S130F1020I3N
Manufacturer Intel
Catalog Custom Parts (E - I)
Sample
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ECAD Module
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RoHS Compliant
Win Source Part Number 1195701-EP2S130F1020I3N
Categories Custom Parts
Manufacturer Intel
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian EP2S130F1020I3N CAD Model

Description

The Intel EP2S130F1020I3N is a high-performance Stratix II FPGA (Field Programmable Gate Array) designed for demanding applications requiring substantial logic density, advanced features, and high-speed operation. As part of the Stratix II family, this FPGA offers a combination of performance, density, and features that makes it suitable for a wide range of applications.

Applications:

  • High-Speed Data Acquisition: Used in systems that require capturing and processing large amounts of data in real-time, such as scientific instrumentation and medical imaging.
  • Telecommunications Infrastructure: Employed in networking equipment, such as routers and switches, for packet processing, traffic management, and protocol implementation.
  • Video Processing: Applied in video encoding/decoding systems, image processing, and display controllers for high-resolution video applications.
  • Aerospace and Defense: Utilized in radar systems, signal processing, and embedded control systems, benefiting from the device's performance and reliability.
  • Industrial Automation: Integrated into programmable logic controllers (PLCs), motor control systems, and industrial networking for real-time control and data processing.

Features:

  • Logic Elements: Offers a high density of logic elements (approximately 130,000) allowing for the implementation of complex digital circuits.
  • Memory Blocks: Includes embedded memory blocks (M5K blocks) for on-chip data storage, providing flexibility and performance for memory-intensive applications.
  • DSP Blocks: Features dedicated Digital Signal Processing (DSP) blocks that enable high-performance arithmetic operations for signal processing and algorithm acceleration.
  • Clock Management: Provides advanced clock management circuitry, including PLLs (Phase-Locked Loops), for clock synthesis and distribution, ensuring timing accuracy and stability.
  • I/O Interfaces: Supports a wide range of I/O standards, including LVDS, HSTL, and SSTL, allowing for flexible connectivity to external devices and systems.
  • Package: Housed in a 1020-pin FineLine BGA (FBGA) package, providing a high pin count for extensive I/O connectivity.

Benefits:

  • High Performance: Enables high-speed operation and real-time processing, making it suitable for demanding applications.
  • Flexibility: Allows for custom hardware implementation and reconfiguration, providing flexibility to adapt to changing requirements.
  • Integration: Integrates logic, memory, and DSP functions on a single chip, reducing system complexity and board space.
  • Time-to-Market: Accelerates product development with easy design and simulation tools.
  • Cost-Effectiveness: Offers a cost-effective solution for high-performance applications, reducing overall system costs.

Additional Details:

The EP2S130F1020I3N operates over the industrial temperature range. Its architecture also includes features for power management, allowing for optimization of power consumption based on application requirements. The FPGA is programmed using industry-standard hardware description languages (HDLs) such as VHDL or Verilog, and Intel provides comprehensive design tools and support for development and debugging.

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