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LFE2M35E-6FN484C

Part No LFE2M35E-6FN484C
Manufacturer Lattice Semiconductor Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 303 I/O 484FBGA / FPGA LatticeECP2M Family 34000 Cells 90nm Technology 1.2V 484-Pin FBGA Tray
Datasheet
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Rohs State rohs
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Categories Integrated Circuits (ICs)
Manufacturer Lattice Semiconductor Corporation
Series ECP2M
Number of LABs/CLBs 4250
Number of Logic Elements/Cells 34000
Total RAM Bits 2151424
Number of I/O 303
Operating Supply Voltage 1.14 V ~ 1.26 V
Mounting SMD
Operating Temperature Range 0°C ~ 85°C (TJ)
Package 484-BBGA
Manufacturer Package 484-FPBGA (23x23)
Win Source Part Number 778524-LFE2M35E-6FN484C
Popularity Medium
Supply and Demand Status Limited
Family Name ECP2M35
Introduction Date February 07, 2006
ECCN 3A991.d
Country of Origin Malaysia
Halogen Free Compliant
Estimated EOL Date 2026
Ultra Librarian 3D Model Ultra Librarian LFE2M35E-6FN484C CAD Model

Description

The LFE2M35E-6FN484C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation's ECP2M family. It offers a balance of performance, power efficiency, and features, making it suitable for a wide range of applications. The device comes in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package and has a speed grade of -6, indicating its performance level. The 'C' suffix denotes its commercial temperature range.

Applications

  • Video Processing: Used in applications like video surveillance, industrial cameras, and display controllers for image enhancement, scaling, and format conversion.
  • Industrial Automation: Employed in programmable logic controllers (PLCs), motor control systems, and robotics for real-time control and data acquisition.
  • Wireless Communication: Suitable for implementing custom communication protocols, baseband processing, and digital signal processing in wireless devices.
  • Test and Measurement Equipment: Used in logic analyzers, oscilloscopes, and signal generators for high-speed data capture and analysis.
  • Medical Devices: Can be found in medical imaging equipment and patient monitoring systems for data processing and control functions.

Features

  • 35K Logic Elements: Provides a substantial amount of programmable logic for implementing complex digital circuits.
  • Embedded Memory: Includes on-chip RAM blocks for data storage and buffering, reducing the need for external memory.
  • DSP Blocks: Features dedicated Digital Signal Processing (DSP) blocks for accelerating arithmetic operations and signal processing algorithms.
  • High-Speed I/Os: Supports a variety of high-speed I/O standards, including DDR2 and LVDS, for fast data transfer.
  • Power Optimization: Designed for low power consumption, making it suitable for battery-powered and energy-sensitive applications.
  • Flexible Routing Architecture: Provides a versatile routing fabric for efficient signal routing and connectivity.

Benefits

  • Design Flexibility: Enables designers to implement custom logic functions and adapt to changing requirements.
  • Faster Time-to-Market: Allows for rapid prototyping and development of digital systems, shortening the product development cycle.
  • Improved Performance: Accelerates critical algorithms and tasks through hardware acceleration and optimized architecture.
  • Reduced System Cost: Integrates multiple functions into a single device, reducing the bill of materials (BOM) and board space.
  • Enhanced Reliability: Provides robust and reliable operation in demanding environments.

Additional Details

The LFE2M35E-6FN484C operates within a commercial temperature range. It offers a rich set of features, including programmable I/O, clock management circuitry, and configuration options. Detailed specifications, including the number of RAM blocks, DSP block capabilities, and supported I/O standards, can be found in the Lattice Semiconductor datasheet for this device. The FBGA package provides excellent thermal performance and facilitates high-density board layouts.

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