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GD74HC368

Part No GD74HC368
Manufacturer LG
Catalog OEM Parts (F - I)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 994189-GD74HC368
Categories OEM Parts(F-I)
Manufacturer LG
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian GD74HC368 CAD Model

Description

The GD74HC368 is a high-speed CMOS hex inverter buffer/driver with 3-state outputs manufactured by LG. This device is designed for applications requiring high-performance buffering and driving capabilities. The 3-state outputs allow the device to be disabled, providing isolation and preventing bus contention.

Applications:

  • Memory address drivers
  • Clock drivers
  • Line drivers
  • Bus interface
  • Logic level translation

Features:

  • High-speed operation
  • Low power consumption
  • 3-state outputs
  • TTL compatible inputs
  • Wide operating voltage range
  • High output drive capability

Benefits:

  • Increased system performance due to high-speed operation.
  • Reduced power consumption leading to longer battery life in portable devices.
  • Enhanced system flexibility with 3-state outputs allowing bus isolation.
  • Compatibility with TTL logic levels for easy integration with other components.
  • Versatile application across a wide range of operating voltages.

The GD74HC368 utilizes CMOS technology, which provides a combination of high speed and low power consumption. The device features six independent inverters, each with a 3-state output. The 3-state outputs can be enabled or disabled via an output enable (OE) input. When the OE input is high, the outputs are disabled and enter a high-impedance state, allowing multiple devices to share a common bus. The inputs are TTL compatible, allowing the device to be directly interfaced with TTL logic circuits. The wide operating voltage range allows the device to be used in a variety of applications. The high output drive capability enables the device to drive heavily loaded buses or lines. The GD74HC368 is available in a variety of packages, including DIP and SOIC. This device is commonly used in memory systems to buffer and drive address lines, clock distribution networks to drive clock signals, and bus interfaces to isolate and drive bus signals.

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