The MX30UF2G18AC-XQI/T&R is a 2Gb (256Mx8) CMOS Quad SPI NOR Flash memory device manufactured by Macronix. It's designed for high-performance, low-power applications, offering fast read/write speeds and robust data retention. It is commonly used for storing boot code, application code, and data in embedded systems.

Applications

• Embedded Systems
• IoT Devices
• Wearable Technology
• Automotive Applications (e.g., infotainment systems)
• Industrial Control Systems

Features

• 2Gb (256Mx8) memory organization
• Quad SPI interface (Serial Peripheral Interface)
• Supply voltage: 2.7V to 3.6V
• Operating temperature: -40°C to +85°C
• Page Program: (256 + 8) bytes
• Sector Erase: 4KB
• Block Erase: 32KB / 64KB
• Fast Read/Write performance
• Low Power Consumption
• Data Retention: 20 years
• RoHS compliant

Benefits

• High storage capacity in a small package, ideal for space-constrained applications.
• Fast data access via Quad SPI interface reduces system latency.
• Low power consumption extends battery life in portable devices.
• Wide operating temperature range ensures reliable operation in harsh environments.
• Long data retention guarantees data integrity over an extended period.
• Simplified system design due to the SPI interface.

Additional Details

The MX30UF2G18AC-XQI/T&R supports various SPI modes, including standard SPI, Dual SPI, and Quad SPI, allowing for flexible integration into different systems. It features advanced security features such as hardware write protection and password protection to prevent unauthorized access and data corruption. The device is offered in a compact package suitable for surface mount assembly. Its high endurance and reliability make it a suitable choice for applications requiring frequent read/write cycles and long-term data storage.

The T&R suffix refers to Tape and Reel packaging for automated assembly processes. The XQI indicates specific packaging and temperature grade.