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A3PE3000-2FGG896

Part No A3PE3000-2FGG896
Manufacturer Microchip Technology
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 620 I/O 896FBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 11 Weeks
Features series Field Programmable Gate Array (FPGA) IC 620 516096 896-BGA
Manufacturer Microchip Technology
Series ProASIC3E
Package Tray
Number of I/O 620
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 896-BGA
Case / Package 896-FBGA (31x31)
Family Name A3PE3000
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7A
HTSUS 8542.39.0001
Quantity per package 27
Popularity High
Supply and Demand Status Balance
Win Source Part Number 908962-A3PE3000-2FGG896
Ultra Librarian 3D Model Ultra Librarian A3PE3000-2FGG896 CAD Model

Description

    

The A3PE3000-2FGG896 is a high-performance FPGA (Field Programmable Gate Array) device from Microchip Technology's ProASIC3E series. This family of FPGAs is designed for a wide range of applications, offering designers flexibility, low power consumption, and high functionality in a single chip. The A3PE3000-2FGG896, in particular, is well-suited for applications that require a large number of I/Os and a substantial amount of logic resources.

    

Key Features

  
        
  • Logic Elements: The device features a rich array of logic elements that allow for the implementation of complex digital circuits and systems without the need for additional components.
  •     
  • Memory: It includes integrated memory blocks that can be used for data storage, buffering, or as FIFOs, enhancing the device's versatility in data processing applications.
  •     
  • I/O Pins: The FPGA provides a large number of user I/O pins, encapsulated in a fine-pitch BGA (Ball Grid Array) package, enabling it to interface with a wide variety of peripheral devices and systems.
  •     
  • Speed Grade: The '-2' speed grade indicates the device's performance level, ensuring fast and reliable operation for time-critical applications.
  •     
  • Package Type: The FGG896 package is a flip-chip BGA, which offers excellent electrical performance and efficient heat dissipation.
  •   
    

Applications

  

The A3PE3000-2FGG896 FPGA is ideal for a broad spectrum of applications, including but not limited to:

  
        
  • Industrial control systems
  •     
  • Automotive electronics
  •     
  • Telecommunications infrastructure
  •     
  • Medical equipment
  •     
  • Defense and aerospace systems
  •   
    

Design Support

  

Microchip Technology provides comprehensive design support for the A3PE3000-2FGG896, including development tools, software, and documentation to assist engineers in implementing the FPGA in their designs. This support helps to reduce development time and allows for rapid prototyping and deployment of systems utilizing this FPGA.

    

In conclusion, the A3PE3000-2FGG896 from Microchip Technology represents a powerful and flexible solution for designers who require a high-density, feature-rich FPGA. Its combination of performance, I/O capabilities, and support infrastructure makes it an excellent choice for a wide array of electronic applications.

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