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M2S090TS-1FG676I

Part No M2S090TS-1FG676I
Manufacturer Microchip Technology
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-M3 166MHZ 676FBGA / ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 166MHz 676-FBGA (27x27)
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Category Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Mfr Microchip Technology
Series SmartFusion®2
Package Tray
Architecture MCU, FPGA
Core Processor ARM® Cortex®-M3
Flash Size 512KB
RAM Size 64KB
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed 166MHz
Primary Attributes FPGA - 90K Logic Modules
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Number of I/O 425
Base Product Number M2S090
Standard Package 40
RoHS Status RoHS non-compliant
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.39.0001
Win Source Part Number 1337305-M2S090TS-1FG676I
Ultra Librarian 3D Model Ultra Librarian M2S090TS-1FG676I CAD Model

Description

Microchip Technology M2S090TS-1FG676I Product Overview

The M2S090TS-1FG676I is a high-performance, field-programmable gate array (FPGA) from Microchip Technology, designed to meet the needs of various complex digital systems. This device is part of the SmartFusion2 SoC FPGA family, which combines a rich feature set with a high level of integration to provide a versatile and efficient solution for system designers.

At the heart of the M2S090TS-1FG676I is a second-generation flash-based FPGA fabric, which ensures low power consumption and high reliability. The FPGA is complemented by an ARM Cortex-M3 processor, which provides a 32-bit processing capability for embedded applications. This combination allows designers to create systems with both customizable logic and a powerful processor in a single chip, simplifying the design process and reducing time to market.

The device comes in a 676-pin fine pitch ball grid array (FBGA) package, which offers a compact footprint for space-constrained applications. The 'TS' in the product name indicates the device's temperature range, which is specified for industrial temperatures, making it suitable for operation in harsh environments.

Key features of the M2S090TS-1FG676I include:

  • High-density, low-power flash-based FPGA fabric
  • ARM Cortex-M3 processor with up to 166 MHz performance
  • Advanced security features, including secure boot, 256-bit AES encryption, and a random number generator
  • High-speed serial interfaces, including PCIe, XAUI, and native SERDES blocks
  • Comprehensive DSP capabilities for signal processing applications
  • Up to 90K logic elements, providing ample space for complex designs
  • Microcontroller subsystem (MSS) with peripherals such as UART, SPI, I2C, and CAN for easy integration of common interfaces
  • 1.2V core voltage with multiple I/O standards support

The M2S090TS-1FG676I is ideal for a wide range of applications, including industrial control, communication systems, automotive, and defense. Its robust feature set and high level of integration make it a go-to solution for designers who require a reliable, high-performance FPGA with an embedded processor.

With Microchip Technology's support and resources, including development tools and reference designs, users can rapidly develop and deploy systems using the M2S090TS-1FG676I, ensuring a successful product that meets both performance and cost targets.

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