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MT44K32M36RB-107E:A

Part No MT44K32M36RB-107E:A
Manufacturer Micron Technology Inc.
Catalog SDRAM
Description IC RLDRAM 1.125GBIT PAR 168BGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 35 Weeks
Features RLDRAM 3 Memory IC 1.125Gb (32Mb x 36) Parallel 933 MHz 8 ns 168-BGA (13.5x13.5)
Manufacturer Micron Technology Inc.
Package Tray
Operating Temperature Range 0°C ~ 95°C (TC)
Mounting Surface Mount
Package 168-TBGA
Case / Package 168-BGA (13.5x13.5)
Family Name MT44K32M36
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0036
Quantity per package 1190
Popularity High
Supply and Demand Status Balance
Win Source Part Number 928323-MT44K32M36RB-107E:A
Ultra Librarian 3D Model Ultra Librarian MT44K32M36RB-107E:A CAD Model

Description

The MT44K32M36RB-107E:A is a high-performance synchronous dynamic random-access memory (SDRAM) component manufactured by Micron Technology. This memory module is designed for applications that require high bandwidth and low latency, such as networking equipment, high-performance computing, and graphics processing.

Applications

  • Networking Equipment: Used in routers, switches, and other networking devices for buffering and processing data packets.
  • High-Performance Computing: Employed in servers and workstations for high-speed data access and processing.
  • Graphics Processing: Integrated into graphics cards and other graphics processing units (GPUs) for storing textures and frame buffers.
  • Embedded Systems: Utilized in embedded systems requiring high-speed memory for real-time data processing.
  • Telecommunications Equipment: Integrated into telecommunications equipment for signal processing and data storage.

Features

  • High Bandwidth: Offers high data transfer rates, enabling fast data access and processing.
  • Low Latency: Designed for low latency, reducing delays in data access and improving system performance.
  • Synchronous Operation: Operates synchronously with the system clock, ensuring precise timing and data integrity.
  • Double Data Rate (DDR): Utilizes DDR technology to transfer data on both edges of the clock signal, doubling the data transfer rate.
  • On-Die Termination (ODT): Integrated ODT resistors improve signal integrity and reduce reflections.
  • Advanced Power Management: Implements advanced power management features to reduce power consumption.

Benefits

  • Improved System Performance: High bandwidth and low latency improve overall system performance.
  • Enhanced Data Integrity: Synchronous operation and ODT ensure data integrity and reliability.
  • Reduced Power Consumption: Advanced power management features reduce power consumption, extending battery life in mobile devices.
  • Easy Integration: Industry-standard interface simplifies integration with existing systems and controllers.
  • Scalable Solution: Available in various densities and configurations, allowing for scalable memory solutions.
  • Reliable Operation: Designed for reliable operation in demanding environments.

Additional Details

The MT44K32M36RB-107E:A typically operates at a supply voltage of 1.8V. It supports various data transfer modes, including burst mode and pipelined operation. The device is available in a compact package, such as a ball grid array (BGA), for easy surface mounting on printed circuit boards. The operating temperature range is typically from 0°C to +85°C. The module has a capacity of 1GB (32Mx36). The specific package type and dimensions can be found in the product datasheet provided by Micron Technology.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $233.0097 $233.0097
2+ $208.9049 $417.8098
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Availability: 9,800 pieces
Order Increment : 1 pcs
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