The Molex, LLC 43045-0413 is a Micro-Fit 3.0 header designed for wire-to-board connections in diverse electronic applications. As part of the Micro-Fit 3.0 connector system, it is known for its compact size, high current carrying capacity, and reliable performance.

Applications:

• Power supplies
• Industrial automation equipment
• Robotics
• Consumer electronics
• Automotive applications

Features:

• Micro-Fit 3.0 design: Enables high-density connections while conserving PCB space.
• 4 circuits: Accommodates applications needing a small number of connections.
• Single row: Streamlines PCB layout and assembly processes.
• Through-hole mounting: Offers a strong and reliable physical connection to the PCB.
• Polarization: Prevents mismating and ensures correct connection.

Benefits:

• Enhanced Reliability: Ensures consistent and dependable connections in critical applications.
• Simplified Assembly: Streamlines the manufacturing process, reducing assembly time and costs.
• Optimized Space Utilization: The compact design allows for efficient use of PCB real estate.
• Mismating Prevention: Reduces the risk of damage or malfunction due to incorrect connections.
• Cost-Effective Solution: Provides a reliable connection solution at a competitive price point.

Additional Details:

The 43045-0413 header is constructed from high-temperature thermoplastic, making it suitable for reflow soldering processes. It features a flammability rating of UL 94V-0 for enhanced safety. Designed to mate seamlessly with Micro-Fit 3.0 receptacles. The header's design incorporates polarization features to ensure correct mating orientation. The Micro-Fit 3.0 system is designed to provide a high current carrying capacity within a compact form factor. With a variety of options including different circuit sizes, plating materials, and mounting configurations, it offers flexibility for diverse application needs. The robust design ensures reliable performance, even in demanding operating conditions.