The 87833-1031 is a Micro-Fit 3.0 Header from Molex. It is a 10-circuit, single-row, vertical header designed for board-to-wire connections in various electronic applications.

Applications:

• Power supplies
• Industrial automation equipment
• Automotive electronics
• Consumer electronics
• Data and telecommunications equipment

Features:

• Vertical orientation
• Single-row configuration
• 10 circuits
• 3.0mm pitch
• High-temperature thermoplastic housing

Benefits:

• Provides reliable and secure board-to-wire connections.
• Offers a compact design for space-constrained applications.
• Facilitates easy and efficient assembly process.
• Ensures durability and long-term performance in harsh environments.
• Meets industry standards for safety and performance.

Additional Details:

The 87833-1031 header is typically made from a high-temperature thermoplastic material that can withstand reflow soldering processes. It is designed to mate with Molex's Micro-Fit 3.0 receptacles. Key specifications include voltage rating, current rating, and operating temperature range. The 3.0mm pitch allows for high-density connections while maintaining reliable electrical performance. Refer to the Molex datasheet for detailed specifications, mating compatibility information, and recommended PCB layout guidelines. This ensures proper connection and optimal performance of the connector in the application.