Product Overview: MC74HCT245ADW from ON Semiconductor

The MC74HCT245ADW is a high-performance integrated circuit designed and manufactured by ON Semiconductor, a leader in energy-efficient innovations. This device belongs to the HCT family and serves as an octal 3-state non-inverting bus transceiver, which is particularly suitable for driving bus lines or buffer memory address registers. The MC74HCT245ADW offers robust performance with CMOS input compatibility and is designed to be used in interfacing applications in which two-way communication is required.

Constructed with silicon gate CMOS technology, it possesses the high noise immunity and low power consumption of standard CMOS integrated circuits, combined with the ability to drive 15 LSTTL loads. The 74HCT245 has TTL input compatibility when operated in the 4.5V to 5.5V range. The MC74HCT245ADW facilitates the connection between two buses by allowing data transmission from the A bus to the B bus and vice versa, depending on the logic level at the direction control (DIR) input.

Key Features

• Logic Type: Octal Bidirectional Transceiver with 3-state outputs
• Logic Family: HCT
• Supply Voltage Range: 4.5V to 5.5V
• Operating Temperature Range: -55°C to 125°C
• Package / Case: SOIC-20 Wide
• Output Drive Capability: 15 LSTTL Loads
• Propagation Delay Time: 8ns at 4.5V

Applications

The versatility of the MC74HCT245ADW makes it ideal for a wide range of applications, including:

• Bus Interface / Drivers in Microprocessor Systems
• Buffer Memory Address Registers
• Data Communication Systems
• Input/Output Port Interface
• Control Systems

With its robust design and reliable performance, the MC74HCT245ADW from ON Semiconductor is a preferred choice for designers and engineers looking for a high-quality bus transceiver to ensure seamless data communication within their digital systems. Its compatibility with industry-standard logic levels and its wide operating temperature range make it suitable for both commercial and industrial applications. The device is supplied in a surface-mount SOIC-20 wide package, which is conducive to automated assembly processes.