50X50-202 - Versatile Thermal Interface Material

The 50X50-202 is a cutting-edge thermal interface material (TIM) designed to maximize heat transfer efficiency in electronic assemblies. Its expansive usability makes it ideal for numerous applications requiring effective thermal management solutions.

• Applications:
  • CPU & GPU cooling interfaces
  • Power module thermal management
  • LED thermal control
  • Telecommunication devices
• Features and Benefits:
  • High thermal conductivity
  • Superior conformability and compliance
  • Long-term reliability and stability
  • Easy application and removal
• Additional Details:
  • Thermal Conductivity: 5 W/m-K
  • Thickness: 0.2 mm
  • Dielectric Strength: 6 kV/mm