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RF1154TR13-5K

Part No RF1154TR13-5K
Manufacturer Qorvo US Inc.
Catalog Custom Parts (N - R)
Description Rf And Microwave Switch
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ECAD Module
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Win Source Part Number 1192572-RF1154TR13-5K
Categories Custom Parts
Manufacturer Qorvo US Inc.
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian RF1154TR13-5K CAD Model

Description

The RF1154TR13-5K is a high-performance front-end module (FEM) designed and manufactured by Qorvo. This FEM is specifically engineered for WLAN (Wireless Local Area Network) applications operating in the 2.4 GHz band. It integrates a power amplifier (PA), low noise amplifier (LNA), and a transmit/receive (T/R) switch to provide a complete front-end solution for wireless communication systems.

Applications:

  • 2.4 GHz WLAN applications (IEEE 802.11b/g/n)
  • Wireless routers
  • Wireless access points
  • Wireless repeaters
  • IoT devices with Wi-Fi connectivity
  • Wireless USB adapters

Features:

  • Integrated Power Amplifier (PA), Low Noise Amplifier (LNA), and T/R Switch
  • High PA output power
  • Low LNA noise figure
  • Low insertion loss T/R switch
  • Compact surface-mount package
  • Single 3.3V supply voltage
  • High linearity

Benefits:

  • Improved WLAN performance through higher output power and lower noise figure.
  • Reduced component count and board space due to integrated functionality.
  • Simplified design and manufacturing process.
  • Enhanced receiver sensitivity due to low LNA noise figure.
  • Increased transmission range due to high PA output power.
  • Better signal quality and data throughput

Additional Details:

The RF1154TR13-5K operates in the 2.4 GHz frequency band, supporting IEEE 802.11b/g/n standards. The PA typically delivers a high output power while maintaining excellent linearity to minimize signal distortion. The LNA offers a low noise figure to improve receiver sensitivity, enabling the device to detect weak signals. The integrated T/R switch allows the antenna to be shared between the transmitter and receiver, reducing the overall system cost and size. The device is typically packaged in a small surface-mount package suitable for high-density designs. Consult the datasheet for specific power levels, noise figures, and other performance characteristics.

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