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RF7307SQ

Part No RF7307SQ
Manufacturer RF Micro Devices
Catalog HOT - SALES and EOL Components (Q - R)
Sample
Rohs State rohs
ECAD Module
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Manufacturer RF Micro Devices
Win Source Part Number 293839-RF7307SQ
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian RF7307SQ CAD Model

Description

The RF7307SQ is a high-performance front-end module (FEM) designed for WLAN applications in the 2.4 GHz band. It integrates a power amplifier (PA), low noise amplifier (LNA), and transmit/receive switch (T/R switch) into a single compact package. This integration simplifies the design and reduces the board space required for WLAN front-end circuitry.

Applications:

  • Wireless routers: Used to enhance the transmit power and receive sensitivity in wireless routers operating in the 2.4 GHz band.
  • Wireless access points: Implemented in wireless access points to improve signal range and data throughput.
  • IoT devices: Suitable for various IoT devices that require reliable Wi-Fi connectivity.
  • Mobile devices: Integrated into smartphones and tablets to boost Wi-Fi performance.
  • Wireless repeaters: Employed in wireless repeaters to extend the coverage area of a wireless network.

Features:

  • Integrated PA, LNA, and T/R switch: Reduces external component count and simplifies design.
  • High transmit power: Provides sufficient output power for extended range and robust signal strength.
  • Low noise figure: Improves receiver sensitivity, allowing for better signal reception in noisy environments.
  • Compact package: Facilitates easy integration into small form factor devices.
  • 2.4 GHz band operation: Specifically designed for WLAN applications in the 2.4 GHz ISM band.

Benefits:

  • Improved Wi-Fi performance: Enhances transmit power and receive sensitivity for better overall Wi-Fi performance.
  • Simplified design: The integrated module reduces the complexity of the front-end design.
  • Reduced board space: Compact package allows for smaller and more efficient designs.
  • Lower system cost: Integration can lead to lower overall system cost compared to discrete component solutions.
  • Increased reliability: Integration reduces the number of solder joints, improving overall system reliability.

Additional Details:

The RF7307SQ is typically supplied in a small QFN package. It requires a supply voltage in the range of 3.0V to 5.0V. The specific transmit power and noise figure will depend on the exact operating conditions. The module is designed to meet the requirements of IEEE 802.11b/g/n standards. It features integrated matching networks for optimal performance. The power amplifier is typically a GaAs HBT or pHEMT design to provide high efficiency and linearity. The low noise amplifier utilizes silicon or GaAs technology to achieve low noise performance and minimal power consumption. The integrated switch is designed to handle high power levels and low insertion loss.

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Shipping Information

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