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CL31A475KPHNNWE

Part No CL31A475KPHNNWE
Manufacturer Samsung
Catalog Miscellaneous
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Categories Uncategorized
Manufacturer Samsung
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 820535-CL31A475KPHNNWE
Ultra Librarian 3D Model Ultra Librarian CL31A475KPHNNWE CAD Model

Description

The CL31A475KPHNNWE is a multilayer ceramic capacitor (MLCC) manufactured by Samsung Electro-Mechanics. These capacitors are commonly used in a wide range of electronic devices for applications such as decoupling, filtering, and bypass.

Applications

  • Smartphones
  • Tablets
  • Automotive Electronics
  • Industrial Equipment
  • Power Supplies
  • Audio Equipment

Features

  • Capacitance: 4.7µF
  • Voltage Rating: 16V
  • Case Size: 1206 (3.2mm x 1.6mm)
  • Temperature Coefficient: X5R (-55°C to +85°C, ±15%)
  • RoHS Compliant
  • Surface Mount Device (SMD)

Benefits

  • Effective Decoupling: Reduces noise and voltage fluctuations in power lines.
  • Improved Signal Integrity: Filters out unwanted frequencies and harmonics.
  • Space Saving: Compact size allows for high-density board layouts.
  • Stable Performance: Reliable operation over a wide temperature range.
  • Environmentally Friendly: Complies with RoHS standards.

Technical Specifications

The CL31A475KPHNNWE features a capacitance of 4.7 microfarads (µF) with a tolerance of ±10%. It has a voltage rating of 16 volts DC. The X5R temperature coefficient means the capacitance changes by no more than ±15% over the temperature range of -55°C to +85°C. The 1206 case size is a standard SMD package, suitable for automated assembly processes using reflow soldering. The capacitor's construction using ceramic materials ensures a long lifespan and high reliability. It is particularly well-suited for decoupling power rails in digital circuits, smoothing out voltage fluctuations and preventing malfunctions. Its low equivalent series resistance (ESR) also contributes to its effectiveness in filtering applications.

The component is designed for surface mount technology (SMT) assembly, which allows for high-density component placement on printed circuit boards (PCBs). Its robust construction ensures stable performance under various operating conditions, making it suitable for demanding applications in automotive and industrial electronics.

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