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K4S641633FRN75

Part No K4S641633FRN75
Manufacturer Samsung
Catalog OEM Parts (J - L)
Description K4S641633F-RN75 Samsung
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Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1066752-K4S641633FRN75
Categories OEM Parts(J-L)
Manufacturer Samsung
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian K4S641633FRN75 CAD Model

Description

The Samsung K4S641633FR-N75 is a 64Mbit SDRAM (Synchronous Dynamic Random-Access Memory) chip. This component is designed for use in a variety of applications requiring high-speed data access and storage. It's manufactured by Samsung, a leading provider of memory solutions.

Applications

  • Graphics cards
  • Networking equipment
  • Consumer electronics
  • Embedded systems
  • Gaming consoles

Features

  • 64Mbit Density: Provides a substantial amount of memory for various applications.
  • SDRAM Technology: Offers high-speed data transfer rates due to its synchronous operation with the system clock.
  • Multiple Banks: The memory is organized into multiple banks, allowing for concurrent access and improved performance.
  • JEDEC Standard Compliance: Adheres to industry standards, ensuring compatibility with a wide range of systems.
  • Low Power Consumption: Designed for efficient power usage, making it suitable for battery-powered devices.

Benefits

  • High Performance: Enables fast data access and processing, improving overall system performance.
  • Reliability: Samsung's reputation for quality ensures a reliable memory solution.
  • Compatibility: JEDEC compliance ensures seamless integration with existing systems.
  • Cost-Effective: Provides a balance of performance and cost, making it an attractive option for various applications.
  • Efficient Power Usage: Reduces power consumption, extending battery life in portable devices.

Additional Details

The K4S641633FR-N75 operates at a specific clock frequency, typically around 133MHz. The data width is often 16 bits, but this can vary depending on the specific configuration. It requires a power supply voltage of 3.3V. The operating temperature range typically spans from 0°C to 70°C, making it suitable for use in standard operating environments. The package type is usually TSOP (Thin Small Outline Package), which allows for efficient board-level mounting and integration.

This memory chip is crucial for applications where rapid and reliable data storage and retrieval are paramount. Its inclusion in a device's design ensures improved system responsiveness and functionality.

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