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Same model may have multiple batches, images only for reference.
SSQ-117-22-F-D-RA-025-LL
Same model may have multiple batches, images only for reference.

SSQ-117-22-F-D-RA-025-LL

Part No SSQ-117-22-F-D-RA-025-LL
Manufacturer Samtec Inc.
Catalog Rectangular Connectors
Datasheet
SSQ-117-22-F-D-RA-025-LL Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects>Rectangular Connectors - Headers, Receptacles, Female Sockets
Mfr Samtec Inc.
Series SSQ
Package Bulk
Connector Type Receptacle
Contact Type Forked
Style Board to Board or Cable
Number of Positions 34
Number of Positions Loaded 33
Pitch - Mating 0.100" (2.54mm)
Number of Rows 2
Row Spacing - Mating 0.100" (2.54mm)
Mounting Type Through Hole, Right Angle
Termination Press-Fit, Solder
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 3.00µin (0.076µm)
Insulation Color Black
Insulation Height 0.195" (4.95mm)
Contact Length - Post 0.100" (2.54mm)
Temperature Range - Operating -55°C ~ 125°C
Material Flammability Rating UL94 V-0
Contact Finish - Post Tin
Voltage Rating 465VAC, 655VDC
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Contact Material Phosphor Bronze
Base Product Number SSQ-117
Standard Package 1
MSL Level Not Applicable
ECCN EAR99
HTSUS 8536.69.4040
Win Source Part Number 1290424-SSQ-117-22-F-D-RA-025-LL
Ultra Librarian 3D Model Ultra Librarian SSQ-117-22-F-D-RA-025-LL CAD Model

Description

The Samtec Inc. SSQ series connector is a 34 position receptacle connector with a forked contact type.

  • Pitch: 0.100" (2.54mm)
  • Mounting Type: right-angle through-hole
  • Voltage Rating: 465VAC and 655VDC
  • Current Rating: amps
  • Contact Finish-Mating: gold with a thickness of 3.00µin (0.076µm)
  • Contact Finish-Post: tin
  • Insulation Material: liquid crystal polymer (LCP)
  • Insulation Height: 0.195" (4.95mm)
  • Temperature Range: -55°C ~ 125°C
  • Flammability Rating: UL94 V-0
  • Application: board to board or cable style applications

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