The SSQ-130-02-G-T is a Tiger Beam™ socket strip manufactured by Samtec. It is designed for high-density board-to-board connections where signal integrity and reliability are essential. This particular model features a double row of 30 positions, a 0.635mm pitch, gold-plated contacts, and tin-plated tails for soldering.

Applications

• High-Density Interconnect: Applications requiring numerous connections within a compact space, like in networking and telecommunications equipment.
• Board-to-Board Connections: Used to connect multiple printed circuit boards (PCBs) within a system.
• Data Acquisition Systems: Found in data acquisition systems for connecting sensors, data loggers, and other peripherals.
• Industrial Automation: Suitable for industrial control systems where robust and reliable connections are critical.
• Medical Devices: Used in medical equipment where data integrity and signal reliability are paramount.

Features

• 0.635mm Pitch: Provides a high-density interconnect solution, maximizing board space.
• Double Row: Offers twice the number of contacts in the same footprint compared to a single-row connector.
• 30 Positions: Accommodates a specific number of signal connections based on application requirements.
• Tiger Beam™ Contacts: Ensures reliable and robust connections with high withdrawal forces.
• Gold Plating (Contacts): Provides excellent conductivity and corrosion resistance for superior signal integrity.
• Tin Plating (Tails): Offers good solderability for secure attachment to the PCB.

Benefits

• Increased Board Density: The fine pitch and double-row design allow for a higher density of connections, optimizing space on the PCB.
• Reliable Signal Transmission: Gold-plated contacts ensure excellent signal conductivity and minimize signal loss.
• Corrosion Resistance: Gold plating provides excellent protection against corrosion, extending the lifespan of the connector.
• Secure Solder Joints: Tin-plated tails offer good solderability for strong and reliable solder joints.
• Versatile Application: Suitable for a wide range of applications requiring high-density and reliable interconnects.

Additional Details

The SSQ-130-02-G-T typically features a black insulator material. The contact material is generally beryllium copper alloy with gold plating over nickel on the contact area and tin plating on the tails. It's designed for reflow soldering processes. Current rating, voltage rating, and operating temperature ranges depend on the specific application and should be verified in the product datasheet.