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S30SC4M

Part No S30SC4M
Manufacturer Shindengen
Catalog HOT - SALES and EOL Components (S)
Description Schottky Rectifiers (SBD) (40V 30A)
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Rohs State Need to verify
ECAD Module
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Manufacturer Shindengen
Win Source Part Number 306607-S30SC4M
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian S30SC4M CAD Model

Description

The Shindengen S30SC4M is a Schottky Barrier Diode. Like other Schottky diodes, it provides fast switching speeds and a low forward voltage drop, contributing to efficient power conversion and rectification. This makes it suitable for applications where minimizing power losses is critical.

Applications:

  • Switch-mode power supplies (SMPS)
  • DC-DC converters
  • High-frequency inverters
  • Freewheeling diodes
  • Reverse polarity protection

Features:

  • Low forward voltage drop: Reduces power dissipation and increases efficiency.
  • Fast switching speed: Enables high-frequency operation and reduces switching losses.
  • High surge current capability: Provides robustness against transient current surges.
  • Small footprint: Allows for compact and space-saving designs.
  • High-temperature operation: Suitable for use in demanding thermal environments.

Benefits:

  • Improved power conversion efficiency: Minimizes heat generation and maximizes system performance.
  • Reduced switching losses: Enables operation at higher frequencies without significant performance degradation.
  • Increased reliability: Provides stable and dependable performance over a wide range of operating conditions.
  • Smaller component size: Allows for more compact and efficient circuit designs.
  • Protection against reverse polarity: Prevents damage to circuits due to accidental reverse voltage connections.

Additional Details:

Important parameters for the S30SC4M include its forward voltage drop (Vf), reverse leakage current (Ir), maximum reverse voltage (Vrrm), and maximum forward current (If). The datasheet must be consulted to determine these values precisely. Thermal considerations are crucial, especially at higher current levels. Proper heatsinking or thermal management techniques may be necessary to prevent overheating and ensure long-term reliability. The package type will dictate the mounting method and thermal interface requirements. The diode's construction typically involves a metal-semiconductor junction formed on a silicon substrate. Specific materials and manufacturing processes are optimized to achieve the desired electrical and thermal characteristics.

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Pricing & Ordering

Quantity Unit Price Ext. Price
18+ $3.3108 $59.5944
43+ $2.7166 $116.8138
66+ $2.6317 $173.6922
91+ $2.5468 $231.7588
118+ $2.4619 $290.5042
157+ $2.2072 $346.5304
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Availability: 10,200 pieces
MOQ: 18 pcs
Order Increment : 1 pcs
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