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S71PL254JDOBFWTBO

Part No S71PL254JDOBFWTBO
Manufacturer Spansion
Catalog Unclassified Memory
Sample
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Manufacturer Spansion
Category Integrated Circuits(ICs)
Family Memory
Win Source Part Number 186533-S71PL254JDOBFWTBO
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian S71PL254JDOBFWTBO CAD Model

Description

The S71PL254JDOBFWTBO is a NOR flash memory device manufactured by Spansion (now Cypress Semiconductor, and later Infineon Technologies). It is a non-volatile memory solution used in a variety of embedded applications. The part number specifies key characteristics such as density, operating voltage, temperature range, and packaging.

Applications

  • Embedded systems boot code and data storage
  • Networking devices (routers, switches) for configuration storage
  • Industrial automation equipment
  • Automotive systems (e.g., infotainment, engine control)
  • Consumer electronics (e.g., digital cameras, media players)

Features

  • 256 Mbit (32 MB) memory density
  • NOR flash architecture for fast random access
  • Page mode operation for efficient program and erase
  • Sector protection to prevent accidental data corruption
  • Low power consumption for battery-powered devices
  • Wide voltage range support
  • Industrial temperature range for harsh environments
  • Various packaging options available

Benefits

  • Reliable and secure storage of critical data
  • Fast boot times and application loading
  • Long data retention for long-term storage needs
  • High endurance for frequent program and erase cycles
  • Energy-efficient operation
  • Simplified system design
  • Cost-effective non-volatile memory solution

Technical Specifications

The S71PL254JDOBFWTBO typically operates at 3V and features a parallel interface. It supports fast read access times, crucial for XIP (execute-in-place) functionality. Security features like sector protection prevent unintended data modifications. Specific timings, power consumption details, and package dimensions are found in the device datasheet. The naming convention provides details about the memory density (256Mbit), core voltage, temperature grade and packaging, which influence the selection for particular embedded designs. Always refer to the official datasheet for precise specifications.

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