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NLC322522T-3R3M

Part No NLC322522T-3R3M
Manufacturer TDK Corporation
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 06+
Reference case SMD
Manufacturer TDK Corporation
Manufacturer Homepage www.tdk.com
Win Source Part Number 733121-NLC322522T-3R3M
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian NLC322522T-3R3M CAD Model

Description

The NLC322522T-3R3M is a wire-wound chip inductor manufactured by TDK Corporation. It is designed for use in various electronic circuits where inductance is required, such as power supplies, filters, and RF circuits. It offers a compact size and good performance characteristics.

Applications:

  • Power supplies
  • Filters
  • RF circuits
  • DC-DC converters
  • Wireless communication devices

Features:

  • Wire-wound construction
  • Compact size
  • High Q factor
  • High self-resonant frequency
  • Surface mount package

Benefits:

  • Efficient energy storage: The wire-wound construction provides good inductance for energy storage applications.
  • Small footprint: The compact size allows for use in space-constrained applications.
  • Improved signal quality: The high Q factor minimizes losses in filter applications.
  • Suitable for high-frequency applications: The high self-resonant frequency enables use in RF circuits.
  • Easy assembly: The surface mount package allows for automated assembly processes.

Additional Details:

The NLC322522T-3R3M inductor features a specific inductance value and current rating. The Q factor and self-resonant frequency are important parameters for determining the inductor's performance in different circuit applications. The device is available in a standard surface mount package, making it compatible with automated assembly processes.

The inductor's operating temperature range and storage temperature range are critical parameters to consider for ensuring reliable operation. The datasheet provides detailed specifications on inductance tolerance, DC resistance, and other key parameters. Proper PCB layout and soldering techniques are essential for achieving optimal performance and reliability. Shielding may be required in some applications to minimize electromagnetic interference (EMI).

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