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SSM3K01F(TE85L,F)

Part No SSM3K01F(TE85L,F)
Manufacturer Toshiba Semiconductor and Storage
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Reference Date Code 1025+
Reference case SOT23
Manufacturer Toshiba Semiconductor and Storage
Manufacturer Homepage www.semicon.toshiba.co.jp/eng
Win Source Part Number 749530-SSM3K01F(TE85L,F)
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian SSM3K01F(TE85L,F) CAD Model

Description

The SSM3K01F(TE85L,F) is a P-channel MOSFET from Toshiba Semiconductor and Storage. It is designed for load switches and high-speed switching applications. This MOSFET offers low on-resistance and is available in a small surface-mount package, making it suitable for space-constrained applications.

Applications:

  • Load switches
  • High-speed switching
  • Portable devices
  • Power management circuits
  • DC-DC converters

Features:

  • P-Channel MOSFET
  • Low on-resistance: RDS(ON) = [Value will depend on VGS, refer to datasheet] @ VGS = -4.5V
  • Gate-Source Voltage: ±20V
  • Drain Current: -1A
  • Enhancement Mode
  • Small surface-mount package: SOT-23 (or equivalent)

Benefits:

  • Efficient Switching: Low on-resistance minimizes power loss during switching, improving energy efficiency.
  • Compact Design: The small package size allows for high-density mounting on PCBs, saving valuable board space.
  • Improved Thermal Performance: Low RDS(ON) reduces heat generation.
  • Reliable Operation: Toshiba's manufacturing processes ensure high reliability and consistent performance.
  • Simplified Circuit Design: Enhancement mode operation simplifies gate drive circuitry.

Additional Details:

The SSM3K01F(TE85L,F) is typically used in applications where a P-channel MOSFET is required for switching or load control. Its low on-resistance is a key advantage in minimizing power dissipation. The specific RDS(ON) value will vary with the gate-source voltage (VGS), so refer to the datasheet for detailed specifications. The SOT-23 package facilitates automated assembly and is compatible with standard soldering techniques.

Datasheet analysis is required for accurate Vgs(th), Idss, and power dissipation. Make sure the application's voltage and current requirements are within the device's absolute maximum ratings to prevent damage or failure. The datasheet also details the device's thermal characteristics, which are crucial for proper heatsinking and thermal management in high-power applications.

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