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TH58DVG4S0ETAK0

Part No TH58DVG4S0ETAK0
Manufacturer Toshiba Semiconductor and Storage
Catalog Unclassified Memory
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits(ICs)
Family Memory
Manufacturer Toshiba Semiconductor and Storage
Win Source Part Number 216917-TH58DVG4S0ETAK0
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian TH58DVG4S0ETAK0 CAD Model

Description

The TH58DVG4S0ETAK0 is a 3D NAND flash memory device manufactured by Toshiba (now Kioxia). It belongs to a family of Serial NAND products and offers a significant storage capacity with enhanced performance and reliability. These devices are commonly used in embedded systems and consumer electronics, such as smartphones, tablets, and solid-state drives (SSDs).

Applications

  • Smartphones and Tablets: Used for internal storage of operating systems, applications, and user data.
  • Solid-State Drives (SSDs): Found in entry-level SSDs to store operating systems, applications, and user files.
  • Embedded Systems: Implemented in various embedded applications where non-volatile storage is required.
  • USB Flash Drives: Provides storage capacity for portable data storage.
  • Memory Cards: Used in various memory card formats like microSD cards for storage in cameras, drones, and other portable devices.

Features

  • 3D NAND Technology: Utilizes a three-dimensional architecture to increase storage density and reduce the physical footprint of the memory chip.
  • High Capacity: Offers significant storage capacity, catering to applications with large data storage requirements.
  • Serial Interface: Uses a serial interface for data transfer, which simplifies the connections and reduces the number of pins required.
  • Low Power Consumption: Designed to minimize power usage, making it suitable for mobile and battery-powered devices.
  • Error Correction Code (ECC): Includes ECC to detect and correct errors, ensuring data integrity and reliability.
  • Multi-Plane Operation: Supports multi-plane operation to improve read and write performance.

Benefits

  • Increased Storage Density: 3D NAND technology provides higher storage capacity in a smaller physical space compared to traditional planar NAND.
  • Enhanced Performance: The serial interface and multi-plane operation enables faster data transfer rates and improved overall performance.
  • Improved Reliability: ECC and advanced error management techniques ensure data integrity and extend the lifespan of the memory.
  • Lower Power Consumption: Optimizes power usage, allowing for longer battery life in portable devices.
  • Cost-Effective: Provides a cost-efficient storage solution for various applications.

Additional Details

The TH58DVG4S0ETAK0 typically operates at a voltage of 1.8V or 3.3V and supports various power-saving modes. The operating temperature range is usually from -25°C to 85°C. The device uses a specific NAND interface standard to communicate with the host system. For detailed technical specifications, such as capacity, interface speed, and endurance, it is crucial to refer to the official datasheet provided by Kioxia.

The package type is generally a compact BGA (Ball Grid Array), allowing for efficient surface mounting on PCBs (Printed Circuit Boards). The memory chip is designed to withstand reflow soldering processes during manufacturing.

Kioxia continues to innovate in NAND flash memory technology, and the TH58DVG4S0ETAK0 represents a key component in a wide range of consumer and embedded applications, providing reliable and high-capacity storage solutions.

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