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XC2V4000-4FFG1152C

Part No XC2V4000-4FFG1152C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 824 I/O 1152FCBGA
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Categories Integrated Circuits (ICs)
Features series Field Programmable Gate Array (FPGA) IC 824 2211840 1152-BBGA, FCBGA
Manufacturer Xilinx Inc.
Series Virtex®-II
Package Tray
Part Status Obsolete
Number of I/O 824
Operating Temperature Range 0°C ~ 85°C (TJ)
Mounting Surface Mount
Package 1152-BBGA, FCBGA
Case / Package 1152-FCBGA (35x35)
Family Name XC2V4000
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 3A001A7A
HTSUS 8542.39.0001
Quantity per package 1
Popularity High
Supply and Demand Status Balance
Win Source Part Number 939253-XC2V4000-4FFG1152C
Ultra Librarian 3D Model Ultra Librarian XC2V4000-4FFG1152C CAD Model

Description

The XC2V4000-4FFG1152C is a high-performance FPGA from Xilinx's Virtex-II family. It is designed for complex digital systems requiring substantial logic resources and high-speed operation. The 'FFG1152' designation indicates a Flip-Chip Fine-Pitch Ball Grid Array package with 1152 pins, facilitating high I/O connectivity. The 'C' suffix denotes a commercial temperature range.

Applications:

  • Wireless Communications: Used in base stations, radio access networks, and wireless infrastructure for signal processing, modulation, and demodulation.
  • Networking Equipment: Implemented in routers, switches, and network processors for packet processing, traffic management, and security functions.
  • Video Processing: Employed in broadcast equipment, video servers, and high-definition displays for video encoding, decoding, and scaling.
  • Data Storage: Integrated in storage area networks (SANs) and network-attached storage (NAS) devices for data management, error correction, and encryption.
  • Test and Measurement: Utilized in logic analyzers, oscilloscopes, and signal generators for data acquisition, signal analysis, and instrument control.

Features:

  • High Logic Capacity: Provides a large number of configurable logic blocks (CLBs) for implementing complex digital circuits.
  • On-Chip Memory Resources: Includes embedded block RAM for high-speed data storage and distributed RAM for flexible memory configurations.
  • Advanced Clock Management: Features digital clock managers (DCMs) for frequency synthesis, clock skew management, and jitter reduction.
  • Flexible I/O Interface: Supports a wide range of I/O standards and protocols, enabling seamless connectivity to external devices.
  • High-Speed Serial Transceivers: Integrates RocketIO multi-gigabit transceivers for high-bandwidth serial communication.

Benefits:

  • Accelerated Development: Enables rapid prototyping and development of complex digital systems.
  • Enhanced Performance: Delivers high-speed operation and optimized resource utilization.
  • Increased Flexibility: Offers a high degree of programmability and customization.
  • Reduced System Cost: Integrates multiple functions into a single device, reducing component count and board space.
  • Improved Reliability: Provides robust performance and stability in demanding environments.

Additional Details:

The XC2V4000-4FFG1152C contains 4,239,360 system gates and 161,280 logic cells. The available distributed RAM is 1,658,880 bits. It features 800 available I/O pins. It operates with a core voltage of 1.5V. The speed grade is -4.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $242.7175 $242.7175
2+ $217.6089 $435.2178
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