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XC3090-70PG175C

Part No XC3090-70PG175C
Manufacturer Xilinx Inc.
Catalog OEM Parts (T - Z)
Description XC3090-70PG175C Xilinx
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RoHS Non-Compliant
Win Source Part Number 1105272-XC3090-70PG175C
Categories OEM Parts(T-Z)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XC3090-70PG175C CAD Model

Description

The XC3090-70PG175C is a Field-Programmable Gate Array (FPGA) manufactured by Xilinx Inc., a member of the XC3000 family. This series offers a configurable platform for implementing complex digital logic circuits. The '-70' typically refers to the speed grade of the device, while 'PG175C' denotes a Plastic Grid Array package with 175 pins and a commercial temperature range.

Applications:

  • Advanced Communication Systems: Used in high-performance communication systems for signal processing and data routing.
  • High-End Industrial Control: Controls complex industrial processes requiring high-speed and precision.
  • Medical Imaging Equipment: Implements image processing algorithms in medical imaging systems.
  • Aerospace Applications: Used in aerospace systems for data acquisition and control.
  • High-Performance Computing: Used as an accelerator in high-performance computing applications.

Features:

  • Configurable Logic Blocks (CLBs): Contains an array of CLBs that can be configured to implement a wide range of logic functions.
  • Input/Output Blocks (IOBs): Provides programmable I/O pins for interfacing with external devices.
  • Programmable Interconnect: Features a flexible interconnect network that allows for routing signals between CLBs and IOBs.
  • Static RAM (SRAM) Configuration: Uses SRAM cells to store the configuration data, enabling in-system reprogrammability.
  • 175-Pin Package: The PG175 package provides a high number of I/O pins for complex designs.

Benefits:

  • Flexibility: Can be reconfigured to implement different logic functions, adapting to changing design requirements.
  • Rapid Prototyping: Enables quick prototyping and validation of complex digital designs.
  • High Performance: Provides high-speed performance for demanding applications.
  • Reprogrammability: Allows for design modifications and bug fixes without requiring hardware replacements.
  • Reduced Time to Market: Significantly reduces the time to market compared to custom ASIC development.

The XC3090-70PG175C operates within a commercial temperature range. The device requires a specific supply voltage; refer to the Xilinx datasheet for the correct voltage and current specifications. The speed grade '-70' is an indicator of its timing performance; consult the datasheet for detailed timing parameters. The device is typically programmed using Xilinx's development tools, like the ISE software. The 175-pin package provides a large number of I/O connections, making it suitable for complex, high-performance applications.

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