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XC3S200A-5FTG256C

Part No XC3S200A-5FTG256C
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 195 I/O 256FTBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Categories Integrated Circuits
Manufacturer Xilinx Inc.
Status Active
Number of LABs/CLBs 448
Number of Logic Elements/Cells 4032
Total RAM Bits 294912
Number of I/O 195
Number of Gates 200000
Supply Voltage - Operating 1.14 V to 1.26 V
Mounting SMD (SMT)
Temperature Range - Operating 0°C to 85°C (TJ)
Case / Package 256-FTBGA (17x17)
Win Source Part Number 057619-XC3S200A-5FTG256C
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC3S200A-5FTG256C CAD Model

Description

The XC3S200A-5FTG256C is a Field-Programmable Gate Array (FPGA) from the Xilinx Spartan-3A series. It is a configurable integrated circuit designed to be programmed after manufacturing. This FPGA offers a versatile solution for various digital logic applications, focusing on a balance between performance, power efficiency, and logic density.

Applications:

  • Industrial Automation: Implemented in programmable logic controllers (PLCs), motor control systems, and robotics.
  • Consumer Electronics: Found in digital TVs, set-top boxes, and multimedia devices for video and audio processing.
  • Automotive Systems: Used in vehicle control systems, driver assistance systems, and infotainment applications.
  • Communication Equipment: Integrated into wireless communication devices, networking hardware, and data transmission systems.
  • Medical Devices: Employed in medical imaging systems, patient monitoring devices, and diagnostic equipment.

Features:

  • Logic Cells: Provides a number of logic cells (approximately 4,320 logic cells) for implementing complex digital circuits.
  • Block RAM: Includes block RAM for on-chip memory storage.
  • Distributed RAM: Features distributed RAM for smaller memory requirements.
  • Digital Clock Managers (DCMs): Integrated DCMs for clock frequency synthesis and management.
  • I/O Pins: Provides a certain number of I/O pins (256-pin FTG package) for interfacing with external devices.
  • Operating Voltage: Operates at a defined core voltage for compatibility with digital logic levels.
  • Temperature Grade: Available in different temperature grades to suit diverse operating environments.
  • Configuration Options: Supports various configuration methods, including JTAG and SPI.

Benefits:

  • Flexibility: Allows for hardware customization and reconfiguration without requiring new hardware.
  • Fast Prototyping: Enables rapid design iteration and validation, reducing time-to-market.
  • Cost-Effective: Offers a cost-efficient alternative to ASICs for low to medium volume production.
  • Performance: Delivers high performance for demanding digital logic and signal processing tasks.
  • Integration: Integrates memory, clock management, and I/O interfaces on a single chip.

Technical Specifications: The XC3S200A-5FTG256C has a core voltage around 1.2V. It comes in a 256-pin FTG package. Key components include block RAM, distributed RAM, and digital clock managers. The 'C' indicates commercial temperature grade, and '-5' represents the speed grade.

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Pricing & Ordering

Quantity Unit Price Ext. Price
2+ $41.6462 $83.2924
4+ $34.1713 $136.6852
6+ $33.1035 $198.6210
8+ $32.0355 $256.2840
10+ $30.9678 $309.6780
13+ $27.7641 $360.9333
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 179 pieces
MOQ: 2 pcs
Order Increment : 1 pcs
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