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Same model may have multiple batches, images only for reference.
XC3S200AN-4FT256I Real Image
Same model may have multiple batches, images only for reference.

XC3S200AN-4FT256I

Part No XC3S200AN-4FT256I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 195 I/O 256FTBGA
Datasheet
XC3S200AN-4FT256I Datasheet
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Manufacturer Xilinx Inc.
Series Spartan-3AN
Number of LABs/CLBs 448
Number of Logic Elements/Cells 4032
Total RAM Bits 294912
Number of I/O 195
Number of Gates 200000
Operating Supply Voltage 1.14 V ~ 1.26 V
Mounting SMD
Operating Temperature Range -40°C ~ 100°C (TJ)
Package 256-LBGA
Manufacturer Package 256-FTBGA (17x17)
Win Source Part Number 735829-XC3S200AN-4FT256I
Family Name XC3S200AN
Introduction Date February 06, 2007
ECCN EAR99
Country of Origin Philippines, Republic of Korea, Taiwan
Estimated EOL Date 2022
Is this a common-used part? Yes
Popularity High
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian XC3S200AN-4FT256I CAD Model

Description

The XC3S200AN-4FT256I is an integrated circuit manufactured by Xilinx Inc.. It is a part of the Spartan-3AN series and has a total of 195 I/Os. The operating temperature range of this component is -40°C to 100°C (TJ) and it comes in a 256-LBGA package. The XC3S200AN-4FT256I has 448 LABs/CLBs and 4032 logic elements/cells, with a total of 294912 RAM bits and 200000 gates. This component is a high popularity product and has an estimated EOL date of 2022.

  • Series: Spartan-3AN
  • I/Os: 195
  • Operating Temperature: -40°C to 100°C (TJ)
  • Package: 256-LBGA
  • LABs/CLBs: 448
  • Logic Elements/Cells: 4032
  • RAM Bits: 294912
  • Gates: 200000
  • Estimated EOL: 2022

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