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Same model may have multiple batches, images only for reference.
XC7Z030-1FBG676C Real Image
Same model may have multiple batches, images only for reference.

XC7Z030-1FBG676C

Part No XC7Z030-1FBG676C
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 676FCBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Manufacturer Xilinx Inc.
Packaging Tray
Architecture MCU, FPGA
Core Processor Dual ARM Cortex -A9 MPCore with CoreSight
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex -7 FPGA, 125K Logic Cells
Temperature Range - Operating 0°C ~ 85°C
Manufacturer Package 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Part Number Series XC7Z030
Manufacturer Pack Quantity 1
MSL Level 4 (72 Hours)
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 810860-XC7Z030-1FBG676C
Ultra Librarian 3D Model Ultra Librarian XC7Z030-1FBG676C CAD Model

Description

The Xilinx Inc. XC7Z030-1FBG676C is a medium-popularity integrated circuit (IC).

  • FPGA Family: Kintex-7
  • Logic Cells: 125K
  • Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight, 667MHz
  • I/O Pins: 130
  • RAM Size: 256KB
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Supplier Device Package: 676-FCBGA (27x27)
  • Mounting Type: Surface Mount
  • MSL Level: 4 (72 Hours)
  • RoHS: Compliant
  • Manufacturer Pack Quantity: 1

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Quantity Unit Price Ext. Price
1+ $156.0000 $156.0000
2+ $150.1354 $300.2708
3+ $144.2707 $432.8121
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