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XCZU3EG-L1SFVA625I

Part No XCZU3EG-L1SFVA625I
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 625FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 500MHz, 600MHz, 1.2GHz 625-FCBGA (21x21)
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Manufacturer AMD Xilinx
Packaging Tray
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Temperature Range - Operating -40°C ~ 100°C (TJ)
Case / Package 625-BFBGA, FCBGA
Supplier Device Package 625-FCBGA (21x21)
Number of I/O 180
Base Product Number XCZU3
RoHS Status ROHS3 Compliant
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1318167-XCZU3EG-L1SFVA625I
Ultra Librarian 3D Model Ultra Librarian XCZU3EG-L1SFVA625I CAD Model

Description

The XCZU3EG-L1SFVA625I is a system on chip (SoC) manufactured by AMD Xilinx.

  • Core Processor: quad ARM Cortex-A53 MPCore™ with CoreSight™, dual ARM Cortex-R5 with CoreSight™, and ARM Mali-400 MP2
  • Device Package: 625-FCBGA (21x21)
  • Operating Temperature: -40°C to 100°C
  • FPGA: Zynq UltraScale+ FPGA with 154K+ logic cells
  • RAM Size: 256KB
  • Flash Size: no flash size
  • ROHS Compliance: ROHS3 compliant

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1+ $426.8657 $426.8657
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Availability: 252 pieces
Order Increment : 1 pcs
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