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Same model may have multiple batches, images only for reference.
XC17S30XLPDG8C Real Image
Same model may have multiple batches, images only for reference.

XC17S30XLPDG8C

Part No XC17S30XLPDG8C
Manufacturer Amd
Catalog Memory - Configuration Proms for FPGAs
Description IC PROM PROG C-TEMP 3.3V 8-DIP
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Memory - Configuration Proms for FPGAs
Mfr AMD
Package Tube
Product Status Obsolete
Programmable Not Verified
Programmable Type OTP
Memory Size 300kb
Voltage - Supply 3V ~ 3.6V
Temperature Range - Operating 0°C ~ 70°C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)
Supplier Device Package 8-PDIP
Base Product Number XC17S30XL
Standard Package 50 pcs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0061
Win Source Part Number 903538-XC17S30XLPDG8C
Ultra Librarian 3D Model Ultra Librarian XC17S30XLPDG8C CAD Model

Description

The XC17S30XLPDG8C is an integrated circuit memory configuration PROM designed for use with FPGAs manufactured by AMD.

  • Memory Size: 300kb
  • Voltage Supply: 3V to 3.6V
  • Package: 8-DIP
  • Mounting: Through-Hole
  • Temperature Range: 0°C to 70°C
  • Package Quantity: 50 pieces
  • ECCN: EAR99
  • Fake Product Threat: 34%

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