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PXAC260602FC-V1-R0

Part No PXAC260602FC-V1-R0
Manufacturer Cree/Wolfspeed
Catalog Transistors - FETs, MOSFETs - RF
Description IC AMP RF LDMOS H-37248-4
Sample
Rohs State rohs
ECAD Module
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Categories Discrete Semiconductor Products
Estimated Pruduction Lead Time 18 Weeks
Features RF Mosfet LDMOS 28 V 85 mA 2.69GHz 15.7dB 5W H-37248-4
Manufacturer Cree/Wolfspeed
Package Strip
Package H-37248-4
Case / Package H-37248-4
Family Name PXAC260602
MSL Level 3 (168 Hours)
ECCN EAR99
HTSUS 8542.33.0001
Other Part Number PXAC260602FCV1R0XTMA1, PXAC260602FCV1R0XTMA1-ND, SP001401328
Quantity per package 50
Popularity High
Supply and Demand Status Limited
Win Source Part Number 890512-PXAC260602FC-V1-R0
Ultra Librarian 3D Model Ultra Librarian PXAC260602FC-V1-R0 CAD Model

Description

The PXAC260602FC-V1-R0, manufactured by Cree/Wolfspeed, is a Silicon Carbide (SiC) MOSFET power module. These modules are designed for high-efficiency power conversion in demanding applications. SiC MOSFETs offer superior performance compared to traditional silicon MOSFETs, including higher switching frequencies, lower on-resistance, and improved thermal conductivity. This module is designed to provide a robust and efficient solution for power electronics applications.

Applications:

  • Electric Vehicle (EV) Inverters.
  • Solar Inverters.
  • Motor Drives.
  • Power Supplies.
  • Energy Storage Systems.

Features:

  • Silicon Carbide (SiC) MOSFET Technology.
  • Low On-Resistance (Rds(on)).
  • High Switching Frequency Capability.
  • High Blocking Voltage.
  • Integrated Module Design.
  • Optimized Thermal Performance.

Benefits:

  • Increased Efficiency: SiC MOSFETs minimize switching losses and conduction losses.
  • Reduced System Size: Higher switching frequencies allow for smaller passive components.
  • Improved Thermal Management: Enhanced thermal conductivity enables higher power density.
  • Enhanced Reliability: SiC MOSFETs offer greater robustness and longer lifespan.
  • Simplified System Design: Integrated module design reduces complexity and assembly time.

Additional Details:

The PXAC260602FC-V1-R0 typically includes multiple SiC MOSFETs in a half-bridge or full-bridge configuration. Key electrical characteristics include voltage rating, current rating, on-resistance, and switching frequency. Detailed specifications are available in the Cree/Wolfspeed datasheet. The module is designed for efficient heat dissipation, often incorporating a direct-bonded copper (DBC) substrate. This SiC MOSFET power module is ideal for high-power, high-efficiency applications.

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