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Same model may have multiple batches, images only for reference.
CY7C1663KV18-550BZXC Real Image
Same model may have multiple batches, images only for reference.

CY7C1663KV18-550BZXC

Part No CY7C1663KV18-550BZXC
Manufacturer Cypress Semiconductor Corp
Catalog SRAM
Description IC SRAM 144MBIT PARALLEL 165FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 39 Weeks
Features SRAM - Synchronous, QDR II+ Memory IC 144Mb (8M x 18) Parallel 165-FBGA (15x17)
Manufacturer Cypress Semiconductor Corp
Package Tray
Operating Temperature Range 0°C ~ 70°C (TA)
Mounting Surface Mount
Package 165-LBGA
Case / Package 165-FBGA (15x17)
Family Name CY7C1663
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2A
HTSUS 8542.32.0041
Other Part Number 2015-CY7C1663KV18-550BZXC, CY7C1663KV18550BZXC, -CY7C1663KV18-550BZXC
Quantity per package 105
Popularity High
Supply and Demand Status Balance
Win Source Part Number 916452-CY7C1663KV18-550BZXC
Ultra Librarian 3D Model Ultra Librarian CY7C1663KV18-550BZXC CAD Model

Description

The CY7C1663KV18-550BZXC is a high-speed synchronous, QDR II+ memory IC with a capacity of 144Mb (8M x 18).

  • Interface: Parallel interface
  • Package: 165-LBGA package
  • Operating Temperature: 0°C to 70°C (TA)
  • Family: CY7C1663 family
  • Category: Integrated circuits (ICs)
  • Supply and Demand: Balanced
  • Quantity per Package: 105
  • Lead Time: Estimated production lead time is 39 weeks
  • REACH: REACH status is unaffected
  • HTSUS Code: 8542.32.0041

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1+ $366.3419 $366.3419
2+ $328.4443 $656.8886
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