74F374SC - High-Performance Flip-Flop

With its SHRINK-DIP package, the 74F374SC offers similar functionality to other models in the 74F374 series, with an emphasis on saving space without sacrificing performance or reliability in digital storage applications.

• Embedded Systems
• Computer Peripherals
• Data Management Systems

Features and Benefits

• Compact SHRINK-DIP package to save board space
• Superior data handling with low set-up and hold times
• High noise immunity
• Enhanced TTL compatibility

The 74F374SC is a versatile choice for engineers looking to optimize space and performance in digital system design.