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FDN5330SX

Part No FDN5330SX
Manufacturer Fairchild/ON Semiconductor
Catalog OEM Parts (F - I)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1058836-FDN5330SX
Categories OEM Parts(F-I)
Manufacturer Fairchild/ON Semiconductor
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian FDN5330SX CAD Model

Description

The FDN5330SX is a dual N-Channel PowerTrench® MOSFET from Fairchild Semiconductor (now ON Semiconductor). This device integrates two MOSFETs in a single package, making it suitable for space-constrained applications where multiple switching functions are required.

Applications:

  • Load switching in portable devices.
  • Power management in battery-powered systems.
  • DC-DC conversion.
  • Motor control applications.
  • Power multiplexing circuits.

Features:

  • Dual N-Channel MOSFETs: Two MOSFETs in a single package save board space.
  • Low on-resistance (RDS(on)): Minimizes conduction losses and improves efficiency.
  • Logic-level gate drive: Allows direct drive from low-voltage logic circuits.
  • Small footprint: Compact package for space-constrained applications.
  • RoHS compliant: Meets environmental regulations.

Benefits:

  • Space Savings: Integration of two MOSFETs in a single package reduces board space requirements.
  • Improved Power Efficiency: Low RDS(on) minimizes power loss and improves overall efficiency.
  • Simplified Design: Logic-level gate drive simplifies the drive circuitry.
  • Reduced Component Count: Integration reduces the number of components required.

Additional Details:

The FDN5330SX typically features a drain-source voltage (VDS) rating of 30V and a continuous drain current (ID) rating that depends on the specific package and operating conditions. It is crucial to consult the datasheet for the precise specifications for each individual MOSFET within the package. The PowerTrench® technology used in these MOSFETs provides excellent switching performance and low on-resistance. The device is typically available in a small outline package (SOP) for efficient board mounting. The thermal resistance characteristics are important for thermal management in the application.

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