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MC68605IFN12

Part No MC68605IFN12
Manufacturer Freescale Semiconductor - NXP
Catalog OEM Parts (M - N)
Description MC68605IFN12 Motorol
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1077506-MC68605IFN12
Categories OEM Parts(M-N)
Manufacturer Freescale Semiconductor - NXP
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian MC68605IFN12 CAD Model

Description

The MC68605IFN12 is an X.25 Protocol Controller, designed by Freescale Semiconductor (now NXP), that manages the complexities of X.25 packet assembly/disassembly (PAD) and link-level protocol management. This single-chip solution greatly simplifies the integration of X.25 communication capabilities into embedded systems and data communication equipment.

Applications

  • X.25 network interfaces: Provides a dedicated interface for connecting to X.25 packet-switched networks.
  • Packet Assembler/Disassembler (PAD) devices: Implements PAD functions for interfacing asynchronous devices to X.25 networks.
  • Data Communication Equipment (DCE): Found in modems, X.25 switches, and other networking hardware.
  • Terminal servers: Enables multiple asynchronous terminals to share a single X.25 connection efficiently.
  • Industrial control and monitoring systems: Facilitates reliable data transfer across X.25 networks in industrial environments.

Features

  • Integrated X.25 LAPB controller: Handles the Link Access Procedure Balanced (LAPB) protocol, ensuring reliable link-level communication.
  • Packet assembly/disassembly (PAD) functionality: Converts asynchronous data into X.25 packets and vice versa, enabling seamless integration of asynchronous devices.
  • HDLC frame support: Complies with the High-Level Data Link Control (HDLC) standard for robust data transmission.
  • Multi-channel support: Can manage multiple simultaneous X.25 connections.
  • On-chip timers: Provides timing functions essential for link management and error recovery processes.

Benefits

  • Simplified X.25 integration: Reduces the complexity and effort required to implement X.25 communication in embedded systems.
  • Lower system cost: Integrating PAD and LAPB functions onto a single chip reduces the component count and board space requirements.
  • Improved performance: Offloading packet processing tasks from the host CPU enhances system performance and responsiveness.
  • Enhanced reliability: Incorporates robust error detection and correction mechanisms to ensure reliable data transmission.
  • Flexible configuration: Allows customization of X.25 parameters to meet specific network requirements.

Additional Details

The MC68605IFN12 supports data rates up to 2 Mbps and uses a 68-pin PLCC (Plastic Leaded Chip Carrier) package. It typically operates with a 12 MHz clock frequency and conforms to CCITT X.25 Recommendations.

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