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236401\512MB\32Mx8\16C\49

Part No 236401\512MB\32Mx8\16C\49
Manufacturer Hynix Semiconductor
Catalog Memory - Modules
Description DDR-333 64Mx64 (512MB)
Sample
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ECAD Module
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Categories Memory - Modules
Win Source Part Number 951608-236401\512MB\32Mx8\16C\49
Series *
Ultra Librarian 3D Model Ultra Librarian 236401\512MB\32Mx8\16C\49 CAD Model

Description

The Hynix Semiconductor 236401 is a 512MB memory module configured as 32Mx8 with a 16C timing specification. The additional number '49' might refer to a specific revision, batch number, or internal code within Hynix. This module is designed for providing temporary data storage in computing devices requiring memory resources.

Applications:

  • Legacy Desktop PCs: Provides system memory for older computers.
  • Laptop Computers: Supports portable computing by providing necessary memory resources.
  • Embedded Systems: Used in industrial control systems and other embedded applications requiring memory.
  • Network Devices: Provides buffer memory for routers, switches, and other networking hardware.
  • Printers and Scanners: Used for temporary storage during image processing and document handling.

Features:

  • 512MB Capacity: Offers a moderate amount of memory for basic computing tasks.
  • 32Mx8 Configuration: Organizes the memory into 32 million words, each 8 bits wide.
  • 16C Timing: Indicates a specific CAS Latency (Column Address Strobe latency) rating.
  • Standard Module Format: Adheres to a standard module form factor for compatibility.
  • Fast Data Transfer: Supports relatively fast data access and transfer rates.

Benefits:

  • Improved System Performance: Enhances the speed and responsiveness of older systems.
  • Enhanced Multitasking: Allows multiple applications to run concurrently.
  • Increased Data Throughput: Enables faster data processing and transfer rates.
  • Cost-Effective Memory Solution: Provides a balance of performance and affordability.
  • Easy Integration: Designed for straightforward installation into compatible systems.

Additional Details:

The Hynix 236401 likely utilizes SDRAM or DDR SDRAM technology. The 32Mx8 configuration specifies the memory's organization, detailing how the data is stored and accessed. The 16C timing refers to the CAS Latency (CL), a key performance parameter which determines the delay between requesting data and receiving it. A lower CAS Latency generally improves performance. The '49' appended to the part number may represent a manufacturing revision or internal tracking code. Datasheet review is important for determining precise voltage and frequency requirements, ensuring compatibility with the intended host system. Proper ESD (Electrostatic Discharge) precautions should be taken to avoid damage during installation.

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