The H5TQ4G63AFR-G7I is a DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip manufactured by Hynix Semiconductor. It is a 4Gb (Gigabit) memory component designed for applications that require high-speed data access and moderate power consumption. The organization of this chip is 256M x 16.

Applications

• Desktop PCs
• Laptop Computers
• Graphics Cards
• Gaming Consoles
• Networking Devices

Features

• Capacity: 4Gb (256M x 16)
• Interface: DDR3 SDRAM
• Operating Voltage: 1.5V (Typical)
• Speed Grade: G7I (Determines the maximum clock frequency and data transfer rate)
• Data Rate: Supports data transfer rates depending on the G7I speed grade.
• Clock Frequency: Operates at a clock frequency dictated by the speed grade.
• Package: FBGA (Fine-Pitch Ball Grid Array) for compact size and efficient thermal dissipation.
• RoHS Compliance: Lead-free and compliant with RoHS environmental standards.
• Power-Saving Modes: Includes features to minimize power consumption during idle periods.
• Double Data Rate: Transfers data on both rising and falling edges of the clock signal.

Benefits

• High Bandwidth: DDR3 technology provides a significant improvement in bandwidth compared to older DDR standards.
• Moderate Power: Operates at 1.5V, contributing to lower power consumption.
• Enhanced Performance: Fast data transfer rates contribute to improved system performance in demanding applications.
• Cost-Effective Solution: DDR3 offers a balance between performance and cost.
• Widespread Availability: DDR3 is a mature technology with readily available components and support.
• Reliable Operation: Designed for stable and reliable performance in various operating conditions.

Additional Details

The 'G7I' speed grade is a crucial specification for this part, determining its maximum operating frequency and data transfer rate. Refer to the Hynix datasheet for detailed timing parameters and specifications associated with the G7I speed bin. This device typically uses a prefetch buffer to enhance data throughput. The FBGA package allows for high-density mounting on PCBs. These chips are commonly used in the construction of memory modules.