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PEEL18CV8P-15L

Part No PEEL18CV8P-15L
Manufacturer ICT
Catalog HOT - SALES and EOL Components (N - P)
Sample
Rohs State rohs
ECAD Module
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Manufacturer ICT
Win Source Part Number 272596-PEEL18CV8P-15L
Is this a common-used part? Yes
Popularity High
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian PEEL18CV8P-15L CAD Model

Description

The PEEL18CV8P-15L is a Programmable Electrically Erasable Logic (PEEL) device manufactured by ICT. It's a programmable chip designed to implement custom logic functions, replacing traditional TTL logic gates. The '18CV8' specifies the PEEL architecture, denoting the input/output configuration and output macrocell type. '-15' represents a propagation delay of 15ns, and 'L' indicates it's a low-power variant.

Applications

  • Low-Power Address Decoding: Used in memory systems in battery-powered or energy-efficient applications.
  • Peripheral Control in Portable Devices: Interfacing microprocessors with peripherals in low-power mobile systems.
  • State Machine Implementation in Embedded Systems: Controlling sequential logic operations in power-constrained environments.
  • Glue Logic in Low-Voltage Circuits: Providing an interface between digital components in low-power designs.
  • Timing Control in Battery-Operated Equipment: Generating and managing timing signals in portable electronic devices.

Features

  • Electrically Erasable: Allows for easy and repeated reprogramming and design modifications.
  • Programmable Logic: Offers a flexible architecture for implementing custom logic functions.
  • Low Power Consumption: Minimizes power dissipation for extended battery life or reduced heat.
  • Moderate Speed: Operates with a 15ns propagation delay, balancing speed and power efficiency.
  • TTL Compatible Inputs/Outputs: Enables seamless integration with standard TTL devices.

Benefits

  • Extended Battery Life: Low power consumption significantly extends operating time in portable devices.
  • Reduced Heat Dissipation: Minimizes heat generation, enabling denser packaging and simplified cooling.
  • Simplified Design: Simplifies circuit design and reduces the number of components required.
  • Improved Reliability: Reduces the number of interconnections, enhancing system reliability.
  • Faster Time-to-Market: Allows for rapid prototyping and design iterations.

The PEEL18CV8P-15L is typically packaged in DIP (Dual In-line Package) or PLCC (Plastic Leaded Chip Carrier) for easy PCB mounting. Programming is performed using standard PROM programming equipment. The 'P' suffix may denote a specific package or temperature range variant. This device is ideal for applications that prioritize low power consumption alongside reasonable performance.

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Shipping Information

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