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IDT74ALVCH16245PV

Part No IDT74ALVCH16245PV
Manufacturer IDT, Integrated Device Technology Inc
Description 3.3V CMOS 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS AND BUS-HOLD
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Manufacturer IDT, Integrated Device Technology Inc
Win Source Part Number 1184897-IDT74ALVCH16245PV
Manufacturer Homepage www.idt.com
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian IDT74ALVCH16245PV CAD Model

Description

The IDT74ALVCH16245PV is a 16-bit transceiver with 3-state outputs. It is part of IDT's ALVCH (Advanced Low-Voltage CMOS Hex) family, designed for high-performance, low-voltage applications. This device provides bidirectional data transfer between two buses, making it suitable for various digital systems requiring data isolation, buffering, or translation.

Applications

  • Memory interfacing
  • Data buffering in high-speed systems
  • Bus isolation
  • Backplane transceivers
  • Level translation between different voltage domains

Features

  • 16-bit bidirectional transceiver
  • 3-state outputs
  • Low voltage operation: Typically operates at 3.3V
  • High-speed operation: Typical propagation delay of around 3ns.
  • Low power consumption: CMOS technology ensures minimal power dissipation.
  • Output drive capability: Provides sufficient drive to interface with other logic devices.
  • TTL compatible inputs: Ensures compatibility with TTL logic levels.

Benefits

  • Improved system performance due to fast switching speeds.
  • Reduced power consumption leading to energy efficiency.
  • Simplified system design with integrated transceiver functionality.
  • Enhanced reliability through robust CMOS technology.
  • Easy integration with other TTL and CMOS components.

Additional Details

The IDT74ALVCH16245PV features a direction control (DIR) input that determines the direction of data flow. When DIR is high, data flows from A to B; when DIR is low, data flows from B to A. The output enable (OE) input controls whether the outputs are enabled or in a high-impedance state. This allows for bus isolation when necessary. The device is designed for hot insertion, meaning it can be inserted or removed from a live system without causing damage. It operates over a wide temperature range, typically -40°C to +85°C. The package type is commonly a TSSOP (Thin Shrink Small Outline Package).

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