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Same model may have multiple batches, images only for reference.
CY14V116N-BZ30XI Real Image
Same model may have multiple batches, images only for reference.

CY14V116N-BZ30XI

Part No CY14V116N-BZ30XI
Manufacturer Infineon Technologies
Catalog Memory
Description IC NVSRAM 16MBIT PAR 165FBGA
Datasheet
CY14V116N-BZ30XI Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Win Source Part Number 300000978-CY14V116N-BZ30XI
Manufacturer Infineon Technologies
Category Integrated Circuits (ICs) -Memory Memory
Package Tray
Package / Case 165-LBGA
Supplier Device Package 165-FBGA (15x17)
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Voltage - Supply 1.7V ~ 3.6V
Memory Organization 1M x 16
Ultra Librarian 3D Model Ultra Librarian CY14V116N-BZ30XI CAD Model

Description

This Infineon Technologies integrated circuit (IC) is a memory component that is ideal for use in a variety of electronic devices. With a memory organization of 1M x 16, this product is designed to provide reliable and efficient performance. The package is a tray, and it is surface mountable, making it easy to install. The access time is 30 ns, and the voltage supply ranges from 1.7V to 3.6V. The operating temperature is -40°C to 85°C, which makes it suitable for use in a wide range of environments. The package/case is 165-LBGA, and the supplier device package is 165-FBGA (15x17).

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