The JST BM22B-PUDSS-TFC(LF)(SN) is a 22-position, 0.8mm pitch, double-row, SMT (Surface Mount Technology) header from the BM series designed for high-density board-to-wire connections in compact electronic devices. The TFC(LF)(SN) suffix indicates that the connector is provided on tape and reel for automated placement, is lead-free, and features tin plating, ensuring RoHS compliance.
Applications:
- Consumer Electronics: Ideal for use in smartphones, tablets, digital cameras, and other portable devices requiring small, high-density connections.
- Industrial Control Systems: Used in compact control panels, sensor interfaces, and data acquisition systems.
- Medical Devices: Integrated into diagnostic equipment, patient monitoring systems, and other medical electronics where space is limited.
- Automotive Electronics: Applied in automotive control units (ECUs), infotainment systems, and sensor modules.
- Networking Equipment: Found in routers, switches, and other network devices requiring high-density board connections.
Features:
- 0.8mm Pitch: Enables ultra-compact, high-density board layouts.
- 22 Positions: Supports a large number of signal or power connections in a small footprint.
- Double-Row Configuration: Maximizes the number of contacts in a minimal area.
- SMT (Surface Mount Technology) Design: Facilitates automated assembly for efficient manufacturing.
- TFC (Tape and Reel) Packaging: Allows for automated pick-and-place assembly, reducing production costs.
- Lead-Free (LF) and Tin (Sn) Plating: Compliant with RoHS environmental standards.
Benefits:
- Ultra-Compact Design: Ideal for space-constrained applications, enabling smaller and more efficient designs.
- High-Density Connectivity: Provides a large number of connections in a small area, maximizing functionality.
- Automated Assembly: Reduces manufacturing time and costs through efficient automated assembly processes.
- Reliable Performance: Ensures secure and stable connections for consistent signal and power transmission.
- Environmental Compliance: Meets RoHS standards, promoting environmentally responsible manufacturing.
Additional Details:
The BM22B-PUDSS-TFC(LF)(SN) is designed to be used with compatible JST BM series crimp contacts and housings for a complete wire-to-board connection. The connector is manufactured from high-quality materials to ensure durability and reliable performance. Detailed specifications, including voltage and current ratings, mating force, and operating temperature range, can be found in the manufacturer's datasheet. Proper soldering techniques and handling are critical for ensuring a robust and reliable connection due to the fine pitch of the connector. The compact size and high-density capabilities make it a popular choice for applications where space is at a premium and numerous connections are required. Its tape and reel packaging further streamlines the manufacturing process, improving overall efficiency.