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Same model may have multiple batches, images only for reference.
THGBMJG9C8LBAU8 Real Image
Same model may have multiple batches, images only for reference.

THGBMJG9C8LBAU8

Part No THGBMJG9C8LBAU8
Manufacturer Kioxia America, Inc.
Catalog Flash
Description IC FLASH 512GBIT EMMC 153FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Features FLASH - NAND Memory IC 512Gb (64G x 8) eMMC 153-WFBGA (11.5x13)
Manufacturer Kioxia America, Inc.
Series e•MMC™
Package Tray
Operating Temperature Range -40°C ~ 105°C (TA)
Mounting Surface Mount
Package 153-WFBGA
Case / Package 153-WFBGA (11.5x13)
Family Name THGBMJG9
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Other Part Number THGBMJG9C8LBAU8YNJ, THGBMJG9C8LBAU8YLJ
Quantity per package 152
Popularity High
Supply and Demand Status Balance
Win Source Part Number 936458-THGBMJG9C8LBAU8
Ultra Librarian 3D Model Ultra Librarian THGBMJG9C8LBAU8 CAD Model

Description

The Kioxia America, Inc. THGBMJG9C8LBAU8 is an integrated circuit that belongs to the 153-WFBGA package.

  • Supply and demand status: balanced
  • Product Type: FLASH - NAND Memory IC 512Gb (64G x 8) eMMC 153-WFBGA (11.5x13)
  • Family: THGBMJG9
  • Operating temperature: -40°C to 105°C (TA)
  • Win Source Part Number: 936458-THGBMJG9C8LBAU8

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