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A3P250-2FG256I

Part No A3P250-2FG256I
Manufacturer Microchip Technology
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 157 I/O 256FBGA / ProASIC3 Field Programmable Gate Array (FPGA) IC 157 36864 256-LBGA
Datasheet
Sample
Rohs State Need to verify
ECAD Module
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Category Integrated Circuits (ICs)>Embedded>FPGAs (Field Programmable Gate Array)
Manufacturer Microchip Technology
Packaging Tray
Total RAM Bits 36864
Number of I/O 157
Number of Gates 250000
Voltage - Supply 1.425V ~ 1.575V
Mounting Surface Mount
Temperature Range - Operating -40°C ~ 100°C (TJ)
Case / Package 256-LBGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number A3P250
RoHS Status RoHS non-compliant
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 90
Win Source Part Number 1323362-A3P250-2FG256I
Ultra Librarian 3D Model Ultra Librarian A3P250-2FG256I CAD Model

Description

Microchip Technology's A3P250-2FG256I FPGA

The A3P250-2FG256I is a highly advanced field-programmable gate array (FPGA) from Microchip Technology, designed to deliver exceptional performance and flexibility for a wide range of applications. This device is part of Microchip's ProASIC3 series, which is known for providing low power, high-functionality solutions with a focus on reliability and security.

Key Features:

  • Density and Performance: The A3P250-2FG256I offers a density of 250,000 gates, which provides ample logic for complex designs. It operates at high speeds, making it suitable for both high-throughput and time-sensitive applications.
  • Power Efficiency: With its low power consumption, this FPGA is ideal for power-sensitive designs, enabling longer battery life in portable devices and reduced energy costs in stationary applications.
  • Security: The device includes advanced security features such as FlashLock® to provide secure programming and prevent unauthorized access to the intellectual property within the FPGA.
  • Package Type: The -2FG256I variant comes in a Fine Pitch Grid Array (FGPA) package with 256 pins, offering a compact footprint and excellent I/O capabilities for space-constrained applications.
  • Temperature Range: Its industrial temperature range, denoted by the 'I' in its part number, means it can reliably operate in extreme conditions, making it suitable for industrial and automotive applications.

Applications:

The A3P250-2FG256I is versatile and can be used in a variety of sectors, including but not limited to:

  • Automotive systems
  • Industrial control systems
  • Medical devices
  • Defense and aerospace electronics
  • Consumer electronics
  • Telecommunications infrastructure

With its combination of high performance, power efficiency, and robust security features, the A3P250-2FG256I from Microchip Technology is a top choice for designers who require a reliable and versatile FPGA solution. Whether you're working on a complex automotive system, an industrial automation project, or a cutting-edge consumer electronic device, this FPGA can help you achieve your design goals with efficiency and confidence.

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