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A3P600-FGG484I

Part No A3P600-FGG484I
Manufacturer Microchip Technology
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 235 I/O 484FBGA / ProASIC3 Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs) - Embedded - FPGAs (Field Programmable Gate Array)
Mfr Microchip Technology
Series ProASIC3
Package Tray
Total RAM Bits 110592
Number of I/O 235
Number of Gates 600000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 484-BGA
Supplier Device Package 484-FPBGA (23x23)
Base Product Number A3P600
Standard Package 40
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Win Source Part Number 1348766-A3P600-FGG484I
Ultra Librarian 3D Model Ultra Librarian A3P600-FGG484I CAD Model

Description

Microchip Technology's A3P600-FGG484I FPGA

The A3P600-FGG484I is a high-performance, feature-rich field-programmable gate array (FPGA) from Microchip Technology's ProASIC3 series, designed to meet the needs of a wide range of applications. This device offers a robust solution for designers looking to create complex digital circuits with a flexible and programmable architecture.

Key Features:

  • High Capacity: The A3P600-FGG484I provides a large array of logic elements, making it suitable for implementing complex logic functions and designs. It supports a high number of user I/Os, allowing for versatile interfacing with other components in a system.
  • Low Power Consumption: Designed with power efficiency in mind, this FPGA is ideal for power-sensitive applications. It operates at a low core voltage, which helps to minimize power dissipation and extend battery life in portable devices.
  • Security: Security is a primary concern in many embedded applications, and the A3P600-FGG484I addresses this with its advanced security features. It includes built-in support for design encryption, helping to protect intellectual property and prevent unauthorized copying or tampering of the design.
  • High Reliability: The device is characterized for industrial temperature ranges, ensuring reliable operation under extreme conditions. This makes it suitable for deployment in industrial, automotive, and other environments where reliability is crucial.
  • Package: The FPGA comes in a Fine-Pitch Grid Array (FGG) package with 484 pins, providing a compact footprint and excellent electrical connectivity.

Applications:

The versatility of the A3P600-FGG484I FPGA makes it an excellent choice for a multitude of applications, such as:

  • Industrial control systems
  • Automotive electronics
  • Telecommunications infrastructure
  • Consumer electronics
  • Medical devices
  • Security systems

With its combination of high-density, low power, and robust security features, the A3P600-FGG484I from Microchip Technology stands out as a compelling option for designers who require a reliable and flexible FPGA solution.

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