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Same model may have multiple batches, images only for reference.
EDB8132B4PB-8D-F-D Real Image
Same model may have multiple batches, images only for reference.

EDB8132B4PB-8D-F-D

Part No EDB8132B4PB-8D-F-D
Manufacturer Micron Technology Inc.
Catalog SDRAM
Description IC DRAM 8GBIT PARALLEL 168FBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 35 Weeks
Features SDRAM - Mobile LPDDR2 Memory IC 8Gb (256M x 32) Parallel 400 MHz 168-FBGA (12x12)
Manufacturer Micron Technology Inc.
Package Bulk
Operating Temperature Range -30°C ~ 85°C (TC)
Mounting Surface Mount
Package 168-WFBGA
Case / Package 168-FBGA (12x12)
Family Name EDB8132
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0036
Quantity per package 1680
Popularity High
Supply and Demand Status Balance
Win Source Part Number 917823-EDB8132B4PB-8D-F-D
Ultra Librarian 3D Model Ultra Librarian EDB8132B4PB-8D-F-D CAD Model

Description

The Micron Technology Inc. EDB8132B4PB-8D-F-D is a SDRAM - Mobile LPDDR2 Memory IC with a capacity of 8Gb (256M x 32).

  • Interface: parallel
  • Speed: 400 MHz
  • Package: 168-FBGA (12x12)
  • Mounting: surface-mounted
  • Operating Temperature: -30°C to 85°C
  • Family: EDB8132
  • Category: Integrated Circuits (ICs)
  • ECCN: EAR99
  • Supply and Demand Status: balanced
  • Pieces per package: 1680
  • Estimated Production Lead Time: 35 weeks
  • REACH: unaffected
  • MSL Level: 3 (168 Hours)

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